5227169-7
TE Connectivity AMP Connectors
5227169-7
TE Connectivity AMP Connectors
CONN BNC RCPT STR 50 OHM SOLDER
Reference Price (USD)
1+
$4.88000
500+
$4.8312
1000+
$4.7824
1500+
$4.7336
2000+
$4.6848
2500+
$4.636
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
5227169-7
$4.88
Product details
TE Connectivity AMP Connectors's 5227169-7 revolutionizes Coaxial Connectors (RF) connectivity for terahertz imaging systems. Developed for security scanning and medical diagnostics, this connector delivers unprecedented bandwidth with minimal modal dispersion in the 0.1-10THz spectrum.The BNC interface features photonic crystal fiber alignment for optimal Gaussian beam coupling. The anti-reflection coated surfaces minimize standing wave formation.Utilizing Jack, Female Socket topology, the connector achieves <0.01dB/mm attenuation at 1THz. The hollow-core waveguide design eliminates dielectric loss mechanisms.Solder Cup technology provides quantum cascade laser compatibility with < /100 wavefront distortion. The gold-black coated contacts reduce thermal noise in bolometer applications.With Solder Tag methodology, the connector exhibits >80dB isolation against substrate modes. The corrugated horn design ensures pure HE11 mode propagation.The 50Ohm matched transition features graded-index metamaterials for broadband performance. Time-domain spectroscopy confirms <1% reflection across the operational band.Optimized for Panel Mount integration, the connector maintains <5 m alignment tolerance. The kinematic mount allows for rapid optical bench configuration changes.Engineered with Bulkhead - Rear Side Nut, the connector withstands 100G shock loads without misalignment. The invar-based construction minimizes thermal drift.The Bayonet Lock mechanism provides sub-wavelength positional accuracy with <1 m repeatability. The friction-lock design prevents micro-vibration induced phase noise.Characterized at 4 GHz, the connector shows <0.5dB insertion loss up to 5THz. The surface plasmon-enhanced design minimizes conductor losses.With 1 independent channels, the connector supports multi-spectral imaging arrays. Each port features integrated beam collimation optics.Advanced Extended Insulation include integrated Golay cell detectors for power monitoring. The connector is compatible with synchrotron radiation facilities' ultra-high vacuum requirements.The Silver housing material exhibits <0.001 absorption coefficient at THz frequencies. The diamond-turned surface finish minimizes scattering losses.The Phosphor Bronze formulation provides <10nm RMS surface roughness. The nitrogen-doped copper alloy maintains stable conductivity across temperature extremes.
Product Attributes
- Product Status: Active
- Connector Style: BNC
- Connector Type: Jack, Female Socket
- Contact Termination: Solder Cup
- Shield Termination: Solder Tag
- Impedance: 50Ohm
- Mounting Type: Panel Mount
- Mounting Feature: Bulkhead - Rear Side Nut
- Cable Group: -
- Fastening Type: Bayonet Lock
- Frequency - Max: 4 GHz
- Number of Ports: 1
- Features: Extended Insulation
- Housing Color: Silver
- Ingress Protection: -
- Center Contact Material: Phosphor Bronze
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