51992-3

The 51992-3 by TE Connectivity Aerospace, Defense and Marine establishes new benchmarks in Terminals - Ring Connectors technology, crafted for ultra-high-speed data transmission systems. This cutting-edge connector integrates advanced signal integrity features with precision manufacturing for 5G infrastructure and data center applications.Featuring D-Shaped architecture, this connector delivers exceptional impedance control. When analyzed in vector network analyzers, its geometry demonstrates <0.5dB insertion loss up to 40GHz.Optimized for 1/2 Stud interfaces, this terminal employs anti-resonant design principles. The patented contact configuration reduces skin effect losses by 35% at high frequencies.With 0.091" (2.31mm) dielectric spacing, this component achieves perfect impedance matching. The controlled thickness tolerance ( 2 m) ensures consistent performance across production batches.The 1.020" (25.91mm) dimension incorporates electromagnetic bandgap structures. These engineered features suppress common-mode noise by 20dB in mixed-signal environments.Precisely tuned to 2.115" (53.72mm), this connector minimizes signal reflections. The length-optimized design maintains rise time integrity for 28Gbps NRZ signals.The Free Hanging (In-Line) configuration enables seamless integration with PCB backplanes. The low-insertion-force design supports 10,000 mating cycles without performance degradation.Utilizing Crimp technology, this connector achieves <1 characteristic impedance. The ground-optimized termination scheme reduces ground bounce effects in high-speed digital systems.Compatible with 3/0 AWG coaxial cables, this terminal features constant-impedance transitions. The graduated impedance matching eliminates return loss spikes at connection points.The Non-Insulated system employs low-Dk materials for minimal signal distortion. Tested up to 100GHz, the dielectric properties remain stable across temperature extremes.Incorporating Brazed Seam, this connector delivers exceptional crosstalk immunity. The orthogonal pin-field arrangement achieves >60dB near-end crosstalk isolation.Fabricated from Copper, the contacts exhibit excellent high-frequency characteristics. The specialized alloy maintains stable contact resistance up to 125 C.The Tin plating provides ultra-low surface roughness. Surface profilometry measurements show Ra <0.1 m for optimal signal transmission.