519-014-501-360
EDAC Inc.
519-014-501-360
EDAC Inc.
519 SERIES RACK & PANEL CONNECTO
Reference Price (USD)
1+
$45.38400
500+
$44.93016
1000+
$44.47632
1500+
$44.02248
2000+
$43.56864
2500+
$43.1148
Exquisite packaging
Discount
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519-014-501-360
$45.38
Product details
The 519-014-501-360 from EDAC Inc. represents a cutting-edge solution in Backplane Connectors - Specialized, engineered for high-density backplane applications requiring exceptional signal integrity. This advanced connector system combines robust construction with precision engineering to deliver reliable performance in mission-critical environments.Designed specifically for Backplane applications, this product series delivers proven performance in high-speed digital systems up to 56Gbps NRZ.With Plug, Hermaphroditic Contacts configuration, this component ensures optimal mating compatibility while maintaining superior electrical characteristics. The hermaphroditic contact design enhances assembly flexibility in complex systems.Featuring Rack and Panel technology, the connector achieves industry-leading contact reliability, particularly beneficial for high-vibration environments found in industrial automation equipment.The 14 position count provides exceptional scalability for backplane architectures, enabling designers to implement modular system designs with simplified interconnect schemes.When configured with All loaded positions, the connector offers customizable solutions for power distribution networks without compromising signal path density.With 0.150" (3.81mm) centerline spacing, the design achieves optimal balance between high-density packaging and manufacturability requirements.The 3 row configuration enables three-dimensional backplane stacking, particularly valuable in data center orthogonal interconnect architectures.The 6 column arrangement supports wide bus architectures while maintaining controlled impedance characteristics across all signal paths.The Free Hanging (In-Line) mounting option facilitates both standard and high-reliability PCB attachment methods, with proven performance in through-hole reflow processes.Solder methods provide flexibility for both automated assembly processes and field-serviceable connections in telecom infrastructure.Incorporating Backshell, this connector system addresses EMI shielding requirements while providing positive latching mechanisms essential for vibration-resistant installations.Gold plating ensures durable contact surfaces capable of withstanding multiple mating cycles, meeting MIL-STD-202H standards for harsh environment operation.The 10.0µin (0.25µm) coating thickness exceeds industry standards for corrosion resistance, ensuring long-term reliability in humid operating conditions.The Gray housing material complies with UL94V-0 flammability ratings while providing visual differentiation for complex cabling systems.
Product Attributes
- Product Status: Active
- Connector Usage: Backplane
- Connector Type: Plug, Hermaphroditic Contacts
- Connector Style: Rack and Panel
- Number of Positions: 14
- Number of Positions Loaded: All
- Pitch: 0.150" (3.81mm)
- Number of Rows: 3
- Number of Columns: 6
- Mounting Type: Free Hanging (In-Line)
- Termination: Solder
- Contact Layout, Typical: -
- Features: Backshell
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Color: Gray
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