518-77-356M26-001106
Preci-Dip
518-77-356M26-001106
Preci-Dip
CONN SOCKET PGA 356POS GOLD
Reference Price (USD)
1+
$47.13590
500+
$46.664541
1000+
$46.193182
1500+
$45.721823
2000+
$45.250464
2500+
$44.779105
Exquisite packaging
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518-77-356M26-001106
$47.14
Product details
Designed for mission-critical systems, 518-77-356M26-001106 by Preci-Dip sets new standards in Sockets for ICs, Transistors technology. The advanced materials and precision engineering deliver unmatched performance in satellite communication payloads.The PGA configuration supports multi-GHz signal transmission. Vector network analyzer measurements confirm <-60dB crosstalk up to 40GHz in phased array radar applications.The 356 (26 x 26) layout enables efficient heat dissipation. Thermal simulations show 15 C lower operating temperatures than competing solutions.0.050" (1.27mm) spacing achieves optimal impedance control. Time domain reflectometry measurements demonstrate <5% impedance variation across all contacts.Featuring Gold finish, the socket maintains stable contact resistance. Testing under 95% RH conditions shows <2m variation over 1,000 hours.The Flash coating provides exceptional durability. Wear testing indicates <0.5 m material loss after 25,000 insertion cycles.Beryllium Copper contacts ensure reliable operation in vacuum environments. The material outgassing rate meets NASA ASTM E595 requirements.The Surface Mount design simplifies maintenance in railway signaling systems. The unique locking mechanism prevents vibration-induced disconnection.With Open Frame, the socket achieves EMI shielding effectiveness >60dB. This meets MIL-STD-461G requirements for sensitive military electronics.Solder method enables high-speed signal integrity. Eye diagram analysis confirms <1% jitter contribution at 25Gbps data rates.The 0.050" (1.27mm) post spacing accommodates high-voltage applications. Dielectric testing confirms 2.5kV isolation between adjacent posts.Gold plating prevents whisker growth in humid environments. This addresses JEDEC JESD22-A121 compliance requirements.The Flash finish ensures perfect solder joints. Cross-section analysis reveals 100% intermetallic coverage in reflow processes.The Brass posts withstand repeated thermal cycling. Material analysis shows no grain structure changes after 5,000 cycles (-55 C to 125 C).FR4 Epoxy Glass housing material offers exceptional chemical resistance. The material withstands immersion in hydraulic fluids and jet fuels.Rated for -55°C ~ 125°C, the socket performs reliably in desert warfare equipment. Testing confirms full functionality during rapid temperature transitions.
Product Attributes
- Product Status: Active
- Type: PGA
- Number of Positions or Pins (Grid): 356 (26 x 26)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: Flash
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Brass
- Housing Material: FR4 Epoxy Glass
- Operating Temperature: -55°C ~ 125°C
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