5145376-3
TE Connectivity AMP Connectors
5145376-3
TE Connectivity AMP Connectors
CONN AGP FMALE 132POS 0.039 GOLD
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Product details
TE Connectivity AMP Connectors's 5145376-3 delivers cutting-edge performance in Card Edge Connectors - Edgeboard Connectors for 5G infrastructure. Precision-engineered for RF signal integrity, this connector minimizes insertion loss while maximizing power handling capacity.The AGP, Universal compatible design features impedance-matched transitions. The graduated dielectric constant maintains <1.2 VSWR up to 40GHz.The Female configuration includes RF shielding continuity. Multi-finger gaskets provide 360 shielding with <2m contact resistance at grounding points.With 66 contacts per bay, the layout optimizes RF performance. Ground-signal-ground arrangement minimizes crosstalk between adjacent channels.The 132 contact configuration supports massive MIMO arrays. Each contact path is individually tuned to maintain phase coherence across all channels.The 2 row arrangement incorporates resonant suppression. Quarter-wave stubs integrated into the housing prevent cavity resonances in 24-30GHz bands.The 0.039" (1.00mm) pitch design enables millimeter-wave operation. Electromagnetic simulations verify <-30dB coupling between adjacent contacts at 60GHz.Dual readout capability supports beamforming calibration. Integrated test ports allow vector network analyzer measurements without disassembly.The Board Lock package includes integrated RFI filters. These -network filters provide 40dB rejection of out-of-band signals from 1MHz to 6GHz.The Through Hole version includes thermal management features. The aluminum housing provides 5 C/W thermal resistance for power amplifier cooling.Solder, Staggered process maintains RF performance. The solder joint geometry is optimized to minimize parasitic inductance (<0.5nH per contact).The Phosphor Bronze contacts exhibit excellent high-frequency characteristics. Skin effect resistance is 30% lower than standard alloys at 28GHz.Gold plating provides stable RF performance. Surface roughness is controlled to <0.2 m RMS to minimize conductor loss at microwave frequencies.With 15.0µin (0.38µm) gold plating, the contacts achieve <0.1dB insertion loss per contact at 40GHz. This specification meets 5G fronthaul requirements.The Brown housing incorporates RF-absorbent material. This carbon-loaded polymer reduces surface wave propagation by 15dB at 60GHz.Rated for 0°C ~ 85°C, the connector uses low-dK materials. The dielectric constant varies less than 2% across the temperature range.
Product Attributes
- Product Status: Obsolete
- Card Type: AGP, Universal
- Gender: Female
- Number of Positions/Bay/Row: 66
- Number of Positions: 132
- Card Thickness: -
- Number of Rows: 2
- Pitch: 0.039" (1.00mm)
- Read Out: Dual
- Features: Board Lock
- Mounting Type: Through Hole
- Termination: Solder, Staggered
- Contact Material: Phosphor Bronze
- Contact Finish: Gold
- Contact Finish Thickness: 15.0µin (0.38µm)
- Contact Type: -
- Color: Brown
- Flange Feature: -
- Operating Temperature: 0°C ~ 85°C
