5120533-1

TE Connectivity AMP Connectors's 5120533-1 represents the next generation of Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board), optimized for industrial automation systems. This ruggedized connector solution combines high reliability with exceptional EMI shielding performance, making it suitable for factory floor applications where vibration and electrical noise are prevalent.The Plug, Center Strip Contacts design incorporates advanced shielding technology that exceeds IEC 61000-4-3 standards. Unlike conventional connectors, this design provides 360 EMI protection without compromising mating durability.Configuration options ranging from 64 allow for scalable I/O expansion in modular control systems. The balanced contact arrangement minimizes ground bounce effects in high-current applications.Precision-engineered 0.039" (1.00mm) spacing enables reliable connections in dust-prone environments. The anti-wicking design prevents contamination migration between contacts.The 2 row architecture provides optimal current distribution for power-hungry industrial sensors. This configuration reduces voltage drop across the connector by up to 40%.Engineered for Surface Mount installation, the connector withstands mechanical stress exceeding 50G shock loads. The reinforced mounting points are IP67 compliant when properly mated.The specialized Gold formulation resists fretting corrosion caused by micro-vibrations. Independent testing shows 3x better performance than standard finishes in sulfur-rich environments.With 30.0µin (0.76µm) protection, the contacts maintain stable resistance values despite thermal cycling. This thickness has been optimized for arc resistance in high-voltage industrial applications.Flexible 9mm, 11mm, 14mm options accommodate various backplane architectures in control cabinets. The system supports hot-swapping without signal integrity degradation.The 0.289" (7.35mm) profile allows for adequate airflow in enclosed industrial controllers. This design consideration prevents thermal buildup in continuous operation scenarios.