502403B00000
Aavid, Thermal Division of Boyd Corporation
502403B00000
Aavid, Thermal Division of Boyd Corporation
HEAT SINK 12W 1.25"H SPACE SAVER
Reference Price (USD)
1+
$3.25000
500+
$3.2175
1000+
$3.185
1500+
$3.1525
2000+
$3.12
2500+
$3.0875
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
502403B00000
$3.25
Product details
Aavid, Thermal Division of Boyd Corporation's 502403B00000 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 1.630" (41.40mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 1.290" (32.77mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 1.250" (31.75mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.Nickel-plated surface ensures long-term reliability in data center environments. The finish resists sulfurization and maintains emissivity >0.85 after 5 years of operation.
Product Attributes
- Product Status: Not For New Designs
- Type: Board Level
- Package Cooled: -
- Attachment Method: Bolt On
- Shape: Rhombus
- Length: 1.630" (41.40mm)
- Width: 1.290" (32.77mm)
- Diameter: -
- Fin Height: 1.250" (31.75mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: Black Anodized
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