502203B00000
Aavid, Thermal Division of Boyd Corporation
502203B00000
Aavid, Thermal Division of Boyd Corporation
HEAT SINK 6W/.75"H SPACE SAVER
Reference Price (USD)
1+
$1.73185
500+
$1.7145315
1000+
$1.697213
1500+
$1.6798945
2000+
$1.662576
2500+
$1.6452575
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
502203B00000
$1.73
Product details
Aavid, Thermal Division of Boyd Corporation's 502203B00000 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 1.630" (41.40mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 1.290" (32.77mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 0.750" (19.05mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.Nickel-plated surface ensures long-term reliability in data center environments. The finish resists sulfurization and maintains emissivity >0.85 after 5 years of operation.
Product Attributes
- Product Status: Active
- Type: Board Level
- Package Cooled: -
- Attachment Method: Bolt On
- Shape: Rhombus
- Length: 1.630" (41.40mm)
- Width: 1.290" (32.77mm)
- Diameter: -
- Fin Height: 0.750" (19.05mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: Black Anodized
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