5017845009

Designed for next-gen data centers, the 5017845009 by Molex revolutionizes FFC, FPC (Flat Flexible) Connectors - Accessories technology with 112G PAM4 compatibility. This high-speed solution features innovative crosstalk cancellation that delivers 35dB near-end noise suppression.All Cover configurations incorporate air-gap insulation technology achieving Dk<2.0 at 28GHz. When tested under TIA-455-222 conditions, these connectors demonstrate <0.5dB insertion loss variation across 10,000 mating cycles.The scalable 50 architecture supports 400GbE implementations with 3.2Tbps aggregate bandwidth. The optimized via structure reduces stub resonance by 18dB compared to conventional PCB footprint designs.Compatible with 501786 and 501864 Series, this system achieves OIF-CEI-56G-VSR compliance. The liquid crystal polymer housing maintains stable dielectric properties at 95% relative humidity conditions.