50015-1120CLF
Amphenol ICC (FCI)
50015-1120CLF
Amphenol ICC (FCI)
CONN HEADER HD 120POS PCB
Reference Price (USD)
1+
$27.54042
500+
$27.2650158
1000+
$26.9896116
1500+
$26.7142074
2000+
$26.4388032
2500+
$26.163399
Exquisite packaging
Discount
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50015-1120CLF
$27.54
Product details
The 50015-1120CLF from Amphenol ICC (FCI) represents a cutting-edge solution in Backplane Connectors - Specialized, engineered for high-density backplane applications requiring exceptional signal integrity. This advanced connector system combines robust construction with precision engineering to deliver reliable performance in mission-critical environments.Designed specifically for Daughtercard applications, this product series delivers proven performance in high-speed digital systems up to 56Gbps NRZ.With Header, Male Pins configuration, this component ensures optimal mating compatibility while maintaining superior electrical characteristics. The hermaphroditic contact design enhances assembly flexibility in complex systems.Featuring High Density (HDC, HDI, HPC) technology, the connector achieves industry-leading contact reliability, particularly beneficial for high-vibration environments found in industrial automation equipment.The 120 position count provides exceptional scalability for backplane architectures, enabling designers to implement modular system designs with simplified interconnect schemes.When configured with All loaded positions, the connector offers customizable solutions for power distribution networks without compromising signal path density.With 0.100" (2.54mm) centerline spacing, the design achieves optimal balance between high-density packaging and manufacturability requirements.The 4 row configuration enables three-dimensional backplane stacking, particularly valuable in data center orthogonal interconnect architectures.The 30 column arrangement supports wide bus architectures while maintaining controlled impedance characteristics across all signal paths.The Through Hole mounting option facilitates both standard and high-reliability PCB attachment methods, with proven performance in through-hole reflow processes.Solder methods provide flexibility for both automated assembly processes and field-serviceable connections in telecom infrastructure.Incorporating Mating Guide, this connector system addresses EMI shielding requirements while providing positive latching mechanisms essential for vibration-resistant installations.Gold plating ensures durable contact surfaces capable of withstanding multiple mating cycles, meeting MIL-STD-202H standards for harsh environment operation.The 30.0µin (0.76µm) coating thickness exceeds industry standards for corrosion resistance, ensuring long-term reliability in humid operating conditions.The Black housing material complies with UL94V-0 flammability ratings while providing visual differentiation for complex cabling systems.
Product Attributes
- Product Status: Last Time Buy
- Connector Usage: Daughtercard
- Connector Type: Header, Male Pins
- Connector Style: High Density (HDC, HDI, HPC)
- Number of Positions: 120
- Number of Positions Loaded: All
- Pitch: 0.100" (2.54mm)
- Number of Rows: 4
- Number of Columns: 30
- Mounting Type: Through Hole
- Termination: Solder
- Contact Layout, Typical: -
- Features: Mating Guide
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Black
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