48-6556-41
Aries Electronics
48-6556-41
Aries Electronics
CONN IC DIP SOCKET 48POS GOLD
Reference Price (USD)
1+
$68.44000
500+
$67.7556
1000+
$67.0712
1500+
$66.3868
2000+
$65.7024
2500+
$65.018
Exquisite packaging
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48-6556-41
$68.44
Product details
Designed for mission-critical systems, 48-6556-41 by Aries Electronics sets new standards in Sockets for ICs, Transistors technology. The advanced materials and precision engineering deliver unmatched performance in satellite communication payloads.The DIP, 0.6" (15.24mm) Row Spacing configuration supports multi-GHz signal transmission. Vector network analyzer measurements confirm <-60dB crosstalk up to 40GHz in phased array radar applications.The 48 (2 x 24) layout enables efficient heat dissipation. Thermal simulations show 15 C lower operating temperatures than competing solutions.0.100" (2.54mm) spacing achieves optimal impedance control. Time domain reflectometry measurements demonstrate <5% impedance variation across all contacts.Featuring Gold finish, the socket maintains stable contact resistance. Testing under 95% RH conditions shows <2m variation over 1,000 hours.The 30.0µin (0.76µm) coating provides exceptional durability. Wear testing indicates <0.5 m material loss after 25,000 insertion cycles.Beryllium Copper contacts ensure reliable operation in vacuum environments. The material outgassing rate meets NASA ASTM E595 requirements.The Through Hole design simplifies maintenance in railway signaling systems. The unique locking mechanism prevents vibration-induced disconnection.With Open Frame, the socket achieves EMI shielding effectiveness >60dB. This meets MIL-STD-461G requirements for sensitive military electronics.Solder Cup method enables high-speed signal integrity. Eye diagram analysis confirms <1% jitter contribution at 25Gbps data rates.The 0.100" (2.54mm) post spacing accommodates high-voltage applications. Dielectric testing confirms 2.5kV isolation between adjacent posts.Gold plating prevents whisker growth in humid environments. This addresses JEDEC JESD22-A121 compliance requirements.The 10.0µin (0.25µm) finish ensures perfect solder joints. Cross-section analysis reveals 100% intermetallic coverage in reflow processes.The Brass posts withstand repeated thermal cycling. Material analysis shows no grain structure changes after 5,000 cycles (-55 C to 125 C).Polyphenylene Sulfide (PPS), Glass Filled housing material offers exceptional chemical resistance. The material withstands immersion in hydraulic fluids and jet fuels.
Product Attributes
- Product Status: Active
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 48 (2 x 24)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder Cup
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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