44-6553-11
Aries Electronics
44-6553-11
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS GLD
Reference Price (USD)
1+
$31.12857
500+
$30.8172843
1000+
$30.5059986
1500+
$30.1947129
2000+
$29.8834272
2500+
$29.5721415
Exquisite packaging
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44-6553-11
$31.13
Product details
Aries Electronics's 44-6553-11 redefines reliability standards for Sockets for ICs, Transistors components in medical imaging systems. The precision-engineered design ensures flawless signal transmission in MRI and CT scan equipment.The DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing architecture provides superior EMI shielding effectiveness. Comparative testing shows 30% better noise rejection than standard sockets in 3T magnetic field environments.With 44 (2 x 22) configuration, this socket enables high-density analog front-end designs. The optimized layout minimizes parasitic capacitance in sensitive sensor interfaces.0.100" (2.54mm) spacing achieves optimal signal integrity for low-noise applications. Network analyzer measurements confirm <-70dB crosstalk at 10GHz for RF signal chains.Featuring Gold finish, the socket maintains stable contact resistance in sterile environments. Testing shows <0.5m variation after 500 autoclave cycles at 134 C.Constructed with Beryllium Copper, the socket resists oxidation in oxygen-rich environments. Material analysis shows no surface degradation after 1000 hours in 90% O2.The Through Hole design facilitates quick replacement in surgical robotics. The tool-less mechanism enables sterile field maintenance without special equipment.Incorporating Closed Frame, the socket prevents particulate generation. Testing confirms compliance with ISO 14644-1 Class 4 cleanroom standards.Solder technology ensures gas-tight seals for hermetic medical packages. Helium leak testing verifies <1 10^-9 atm cc/s leak rates.The 0.100" (2.54mm) spacing accommodates high-voltage medical applications. Dielectric testing confirms 5kV isolation for patient-connected equipment.Gold plating prevents biocontamination. Antimicrobial testing shows >99.9% reduction in bacterial growth after 24 hours.The Beryllium Copper posts maintain mechanical properties after radiation sterilization. Testing confirms full functionality after 50kGy gamma irradiation.Polyphenylene Sulfide (PPS), Glass Filled housing material meets USP Class VI biocompatibility standards. The material shows zero cytotoxic effects in elution testing.
Product Attributes
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 44 (2 x 22)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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