44-547-11E
Aries Electronics
44-547-11E
Aries Electronics
CONN SOCKET SOIC ZIF 44POS GOLD
Reference Price (USD)
1+
$219.36000
500+
$217.1664
1000+
$214.9728
1500+
$212.7792
2000+
$210.5856
2500+
$208.392
Exquisite packaging
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44-547-11E
$219.36
Product details
The 44-547-11E from Aries Electronics delivers laboratory-grade precision for Sockets for ICs, Transistors applications in test and measurement equipment. The ultra-stable design ensures <0.1% measurement uncertainty over 10,000 mating cycles.Featuring SOIC, ZIF (ZIP) configuration, the socket provides 10^14 insulation resistance. Guarded measurements confirm <1pA leakage current at 1000V for sensitive instrumentation.With 44 (2 x 22), the socket supports high-precision metrology. The symmetrical layout minimizes thermocouple effects to <0.1 V/ C.The Gold finish provides stable thermoelectric properties. Testing confirms <0.5 V contact potential variation over temperature.20.0µin (0.51µm) thickness ensures long-term stability. Resistance measurements show <10ppm/year drift in controlled environments.Constructed with Beryllium Copper, the socket minimizes magnetic interference. Testing shows <0.1 T field distortion at 1mm distance.The Through Hole design prevents microphonic noise. Testing confirms <1 V vibration-induced noise in sensitive amplifier circuits.Incorporating Closed Frame, the socket provides Faraday cage shielding. Testing shows >100dB RF isolation up to 10GHz for precision measurements.Solder technology ensures negligible insertion loss. Network analyzer measurements show <0.01dB loss at 6GHz for RF test applications.The 0.050" (1.27mm) spacing accommodates precision coaxial connections. Testing confirms <0.05mm positional accuracy for microwave probe stations.Gold plating prevents surface oxidation. XPS analysis shows <1nm oxide growth after 1000 hours in cleanroom environments.The 20.0µin (0.51µm) finish guarantees reproducible connections. Testing shows <0.01% contact resistance variation between mating cycles.The Beryllium Copper posts maintain dimensional stability. Interferometer measurements show <10nm flatness variation over temperature.Polyphenylene Sulfide (PPS), Glass Filled housing material provides ultra-low outgassing. RGA testing shows <1 10^-9 Torr total mass loss for vacuum applications.
Product Attributes
- Product Status: Active
- Type: SOIC, ZIF (ZIP)
- Number of Positions or Pins (Grid): 44 (2 x 22)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 20.0µin (0.51µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 20.0µin (0.51µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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