44-547-11
Aries Electronics
44-547-11
Aries Electronics
CONN SOCKET SOIC ZIF 44POS GOLD
Reference Price (USD)
1+
$219.36000
500+
$217.1664
1000+
$214.9728
1500+
$212.7792
2000+
$210.5856
2500+
$208.392
Exquisite packaging
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44-547-11
$219.36
Product details
The 44-547-11 from Aries Electronics delivers military-grade performance for Sockets for ICs, Transistors applications in defense systems. Designed to exceed MIL-STD-883 requirements, this socket ensures mission success in extreme conditions.Featuring SOIC, ZIF (ZIP) configuration, the socket provides EMP protection for sensitive electronics. Testing confirms survivability in 50kV/m transient electromagnetic fields.With 44 (2 x 22), the socket supports ruggedized avionics designs. The reinforced grid pattern withstands 100G mechanical shock per MIL-STD-810H.The Gold finish resists corrosion in salt fog. Testing per MIL-STD-202G Method 101 shows no degradation after 1000 hours.20.0µin (0.51µm) thickness ensures long-term reliability. Accelerated life testing predicts 20-year service in naval applications.Constructed with Beryllium Copper, the socket withstands ballistic impacts. Testing confirms functionality after 30g 11ms half-sine shock pulses.The Through Hole design prevents loosening in vibration. Testing per MIL-STD-167-1 shows zero connection loss at 29Hz-2kHz random vibration.Incorporating Closed Frame, the socket provides NBC (Nuclear, Biological, Chemical) protection. Sealing tests confirm operation after immersion in decontamination solutions.Solder technology ensures reliability in high-altitude conditions. Testing confirms operation at 70,000 feet with <1% contact resistance change.The 0.050" (1.27mm) spacing accommodates armored cable terminations. Mechanical testing confirms 500N pull-out resistance for field-replaceable connections.Gold plating prevents galvanic corrosion. Testing in marine environments shows no measurable degradation after 5 years.The 20.0µin (0.51µm) finish ensures reliability after sand abrasion. Testing per MIL-STD-810G Method 510.5 shows <5% contact resistance change.The Beryllium Copper posts resist stress corrosion cracking. Testing per ASTM G36 shows no cracking after 1000 hours in boiling MgCl2.Polyphenylene Sulfide (PPS), Glass Filled housing material provides radar absorption. Testing shows -20dB RCS reduction compared to metal housings.
Product Attributes
- Product Status: Active
- Type: SOIC, ZIF (ZIP)
- Number of Positions or Pins (Grid): 44 (2 x 22)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 20.0µin (0.51µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 20.0µin (0.51µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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