438-029-000-112
EDAC Inc.
438-029-000-112
EDAC Inc.
CONN CARDEDGE HSG 29POS .200 GRN
Reference Price (USD)
1+
$9.35280
500+
$9.259272
1000+
$9.165744
1500+
$9.072216
2000+
$8.978688
2500+
$8.88516
Exquisite packaging
Discount
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438-029-000-112
$9.35
Product details
Engineered for next-gen applications, the 438-029-000-112 by EDAC Inc. revolutionizes Card Edge Connectors - Housings with its hybrid contact technology. This innovative connector housing combines gold-over-nickel plating with multi-beam contact design for superior performance in high-vibration environments.Supporting Non Specified - Dual Edge configurations, the housing features anti-wicking grooves that prevent flux migration in wave soldering applications, ensuring long-term reliability.The 29 contact arrangement incorporates staggered impedance tuning for optimized signal propagation delay in high-speed backplane applications.Precisely calibrated for 0.062" (1.57mm) cards, the housing's dual-stage retention system provides both insertion force reduction and positive latching confirmation.The 0.200" (5.08mm) pitch design incorporates ground stitching vias between differential pairs to reduce common-mode noise in RF applications up to 6GHz.The Green housing utilizes laser-direct-structuring (LDS) compatible materials for three-dimensional antenna integration in compact wireless devices.With Top Mount Opening, Unthreaded, 0.128" (3.25mm) Dia, the connector achieves vibration resistance meeting MIL-STD-810G standards for military and aerospace applications.Fabricated from Polyphenylene Sulfide (PPS), the housing demonstrates exceptional hydrolytic stability for operation in high-humidity environments exceeding 95% RH.
Product Attributes
- Product Status: Active
- Card Type: Non Specified - Dual Edge
- Number of Positions: 29
- Card Thickness: 0.062" (1.57mm)
- Pitch: 0.200" (5.08mm)
- Features: -
- Mounting Type: -
- Color: Green
- Flange Feature: Top Mount Opening, Unthreaded, 0.128" (3.25mm) Dia
- Material - Insulation: Polyphenylene Sulfide (PPS)
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