416501U00000G
Aavid, Thermal Division of Boyd Corporation
416501U00000G
Aavid, Thermal Division of Boyd Corporation
COLD PLATE HEAT SINK 0.02C/W
Reference Price (USD)
Exquisite packaging
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416501U00000G
$120.51
Product details
Aavid, Thermal Division of Boyd Corporation's 416501U00000G redefines thermal control standards in Thermal - Liquid Cooling, Heating, optimized for semiconductor manufacturing processes requiring sub-degree temperature accuracy. This precision instrument combines multi-stage cooling with real-time thermal profiling, essential for wafer fabrication cleanrooms.As a Passive, Cold Plate system, it incorporates dual redundant cooling circuits with automatic load balancing, ensuring continuous operation during maintenance cycles.Demonstrating 0.020°C/W @ 1.0 GPM thermal performance, the microchannel cold plate design achieves 40% better heat transfer than conventional designs.With 9.00" L x 5.00" W x 0.60" H (228.6mm x 127.0mm x 15.2mm) dimensions, the vertical stack configuration saves valuable cleanroom floor space while maintaining service accessibility.
Product Attributes
- Product Status: Active
- Product Type: Passive, Cold Plate
- Power - Cooling: -
- Current: -
- Voltage: -
- Flow Rate: -
- Power Input: -
- Thermal Resistance @ GPM: 0.020°C/W @ 1.0 GPM
- Fluid Capacity: -
- Operating Temperature: -
- Connection Type: -
- Weight: -
- Dimensions - Overall: 9.00" L x 5.00" W x 0.60" H (228.6mm x 127.0mm x 15.2mm)
- Ratings: -
- Features: -
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