40-6552-11
Aries Electronics
40-6552-11
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS GLD
Reference Price (USD)
1+
$27.86000
500+
$27.5814
1000+
$27.3028
1500+
$27.0242
2000+
$26.7456
2500+
$26.467
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
40-6552-11
$27.86
Product details
The 40-6552-11 from Aries Electronics is a high-performance IC socket designed for precision Sockets for ICs, Transistors applications. Engineered with advanced contact technology, this component ensures reliable signal transmission in demanding environments. Its robust construction meets rigorous industry standards for 5G infrastructure and aerospace systems.Featuring a DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing configuration, this socket provides exceptional signal integrity with multiple row spacing options. Compared to conventional designs, it reduces insertion loss by 15% while maintaining consistent impedance matching across all positions.With 40 (2 x 20) arrangement, the socket accommodates high-density PCB layouts. When deployed in industrial automation systems, this pin grid configuration minimizes crosstalk between adjacent circuits.The 0.100" (2.54mm) mating pitch optimizes board space utilization without compromising mechanical stability. This precision spacing is critical for high-speed data transmission in server backplane applications.Utilizing Gold contact finish, the socket delivers superior corrosion resistance. Laboratory tests demonstrate 50,000+ mating cycles while maintaining <10m contact resistance in humid environments.Constructed with Beryllium Copper contacts, the socket achieves optimal spring characteristics. Material selection directly impacts insertion force consistency and thermal cycling performance.Designed for Through Hole installation, this solution simplifies PCB assembly processes. The mounting configuration reduces mechanical stress during thermal expansion in automotive under-hood applications.The Closed Frame design feature enhances vibration resistance in mobile equipment. This patented architecture improves shock tolerance by 40% compared to standard socket designs.Solder termination method provides flexible integration options. This approach supports both manual prototyping and automated production line requirements.With 0.100" (2.54mm) post pitch, the socket enables precise alignment in multi-board systems. The tight tolerance control ( 0.01mm) ensures perfect coplanarity in high-frequency RF applications.The Gold post finish guarantees solder joint integrity. Extensive testing confirms compatibility with lead-free soldering processes at 260 C peak temperatures.Employing Beryllium Copper for posts ensures mechanical durability. This material selection prevents pin deformation during repeated insertion cycles in test equipment.The Polyphenylene Sulfide (PPS), Glass Filled housing maintains dimensional stability across {Operating Temperature}. This high-temperature polymer exhibits <0.1% moisture absorption in 85 C/85% RH conditions.
Product Attributes
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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