40-516-11
Aries Electronics
40-516-11
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS GLD
Reference Price (USD)
1+
$20.45000
500+
$20.2455
1000+
$20.041
1500+
$19.8365
2000+
$19.632
2500+
$19.4275
Exquisite packaging
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40-516-11
$20.45
Product details
Aries Electronics's 40-516-11 enables next-generation Sockets for ICs, Transistors solutions for quantum computing applications. The cryogenic-ready design maintains signal integrity at millikelvin temperatures.The DIP, ZIF (ZIP) architecture provides ultra-low thermal conductivity. Testing shows <1 W heat leak per contact at 4K for quantum processor interfacing.With 40 (2 x 20), the socket supports complex qubit control. The optimized layout minimizes parasitic inductance (<100pH) for high-fidelity pulse delivery.0.100" (2.54mm) spacing prevents crosstalk in sensitive measurements. Testing shows <-80dB isolation at 10GHz for quantum state readout.Featuring Gold finish, the socket maintains superconductive properties. Resistance measurements show <10^-8 contact resistance at 4.2K.The 10.0µin (0.25µm) coating ensures thermal matching. CTE measurements show <1ppm/K difference to silicon substrates.Constructed with Beryllium Copper, the socket minimizes magnetic susceptibility. SQUID measurements show <10^-8 emu/g at 4K.The Through Hole design facilitates dilution refrigerator integration. Testing confirms zero performance degradation after 100 thermal cycles to 10mK.Incorporating Closed Frame, the socket provides microwave shielding. Testing shows >60dB attenuation up to 40GHz for qubit protection.Solder technology ensures minimal thermal noise. Johnson noise measurements show <0.1nV/ Hz contribution at 4K.The 0.100" (2.54mm) spacing accommodates superconducting wiring. Critical current testing confirms >100mA per contact at 4.2K.Gold plating prevents oxidation in ultra-high vacuum. XPS analysis shows <0.1nm oxide after 1000 hours at 10^-10 Torr.The 10.0µin (0.25µm) finish ensures reliable connections in vacuum. Testing shows no outgassing products detectable by RGA.The Beryllium Copper posts maintain mechanical properties at cryogenic temperatures. Testing shows <0.1% elastic modulus change from 300K to 4K.Polyamide (PA46), Nylon 4/6, Glass Filled housing material provides radiopure construction. Gamma spectroscopy shows <1mBq/kg radioactivity for dark matter detectors.
Product Attributes
- Product Status: Active
- Type: DIP, ZIF (ZIP)
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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