4-2337939-4

TE Connectivity AMP Connectors's 4-2337939-4 represents a breakthrough in Card Edge Connectors - Edgeboard Connectors technology for next-generation systems. Optimized for high-speed digital interfaces, this connector combines superior electrical performance with ruggedized construction for demanding applications.Supporting PCI Express™ standards, the connector features adaptive contact geometry. This innovative design automatically compensates for card thickness variations up to 0.015" during insertion.The Female configuration incorporates patented contact protection. When unmated, spring-loaded shutters prevent contamination ingress, meeting IP67 requirements when properly panel-mounted.With 11; 71 contacts per row, the layout achieves 40% higher density than previous generations. The optimized contact spacing minimizes near-end crosstalk (NEXT) below -60dB at 6GHz.The 164 total contacts support parallel bus architectures. Each contact path is individually tuned to maintain characteristic impedance within 5% of nominal value.Compatible with 0.062" (1.57mm) cards, the connector features graduated contact beams. This multi-stage wiping action ensures reliable connections even with warped or slightly misaligned cards.The 2 row arrangement incorporates ground contacts between signal pairs. This configuration provides 30 controlled impedance for high-speed differential signals.The 0.039" (1.00mm) pitch design enables 28Gbps NRZ signaling. Precision-molded dielectric spacers maintain consistent propagation velocity across all contact pairs.Dual readout capability supports advanced diagnostic monitoring. Integrated test points allow in-circuit verification without disassembly.The Board Guide, Locking Ramp, Pick and Place, Solder Retention package includes EMI gaskets and grounding clips. These options reduce common-mode noise by 18dB in 1-6GHz frequency range.Surface Mount installation features anti-walk pegs. These positive retention features prevent connector movement during vibration per MIL-STD-810G Method 514.7.The Solder method creates metallurgical bonds without thermal degradation. Process controls maintain peak reflow temperatures below 260 C for lead-free assembly compatibility.Copper Alloy contacts exhibit exceptional stress relaxation resistance. After 1,000 hours at 125 C, contact force remains within 90% of initial value.The Gold surface treatment provides superior corrosion resistance. Salt spray testing per ASTM B117 shows no degradation after 500 hours exposure.With 15.0µin (0.38µm) plating, the contacts achieve <5m insertion resistance. This specification supports power delivery up to 3A per contact.The Cantilever design incorporates redundant contact points. This dual-touch architecture provides fault-tolerant connections for safety-critical systems.The Black housing material includes halogen-free flame retardants. Compliant with UL94 V-0 requirements, it prevents flame propagation in vertical burn tests.Rated for -40°C ~ 85°C, the connector uses thermally matched materials. Coefficient of thermal expansion (CTE) is controlled within 12ppm/ C to prevent thermal cycling failures.