4-2013620-3
TE Connectivity AMP Connectors
4-2013620-3
TE Connectivity AMP Connectors
CONN SOCKET PGA ZIF 989POS GOLD
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Product details
TE Connectivity AMP Connectors's 4-2013620-3 redefines reliability standards for Sockets for ICs, Transistors components in medical imaging systems. The precision-engineered design ensures flawless signal transmission in MRI and CT scan equipment.The PGA, ZIF (ZIP) architecture provides superior EMI shielding effectiveness. Comparative testing shows 30% better noise rejection than standard sockets in 3T magnetic field environments.With 989 (35 x 36) configuration, this socket enables high-density analog front-end designs. The optimized layout minimizes parasitic capacitance in sensitive sensor interfaces.0.039" (1.00mm) spacing achieves optimal signal integrity for low-noise applications. Network analyzer measurements confirm <-70dB crosstalk at 10GHz for RF signal chains.Featuring Gold finish, the socket maintains stable contact resistance in sterile environments. Testing shows <0.5m variation after 500 autoclave cycles at 134 C.The 15.0µin (0.38µm) coating thickness exceeds medical device requirements. Accelerated aging tests predict 10-year reliability in hospital equipment.Constructed with Copper Alloy, the socket resists oxidation in oxygen-rich environments. Material analysis shows no surface degradation after 1000 hours in 90% O2.The Surface Mount design facilitates quick replacement in surgical robotics. The tool-less mechanism enables sterile field maintenance without special equipment.Incorporating Open Frame, the socket prevents particulate generation. Testing confirms compliance with ISO 14644-1 Class 4 cleanroom standards.Solder technology ensures gas-tight seals for hermetic medical packages. Helium leak testing verifies <1 10^-9 atm cc/s leak rates.The 0.039" (1.00mm) spacing accommodates high-voltage medical applications. Dielectric testing confirms 5kV isolation for patient-connected equipment.Tin-Lead plating prevents biocontamination. Antimicrobial testing shows >99.9% reduction in bacterial growth after 24 hours.The 15.0µin (0.38µm) finish ensures reliable connections after repeated sterilization. Testing shows no degradation after 1000 steam sterilization cycles.The Copper Alloy posts maintain mechanical properties after radiation sterilization. Testing confirms full functionality after 50kGy gamma irradiation.Thermoplastic housing material meets USP Class VI biocompatibility standards. The material shows zero cytotoxic effects in elution testing.
Product Attributes
- Product Status: Active
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 989 (35 x 36)
- Pitch - Mating: 0.039" (1.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 15.0µin (0.38µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.039" (1.00mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 15.0µin (0.38µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Thermoplastic
- Operating Temperature: -
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