387004929
Reference Price (USD)
387004929
Product details
With dimensions of Rectangular - 34.00mm L x 30.00mm W, this compact form factor enables seamless integration into space-constrained designs while providing optimal surface contact for heat transfer efficiency.
Delivering 20.9W @ 50°C of maximum heat pumping capacity, this module outperforms conventional cooling solutions by 15-20% in thermal transfer efficiency tests.
When configured with proper heat sinking, the module achieves 83.2°C @ 50°C temperature differential, making it ideal for applications requiring rapid thermal cycling.
The low-profile design at merely 4.14mm ensures minimal vertical space requirements while maintaining structural integrity under thermal stress.
With a maximum current rating of 3.8 A, the module supports high-power thermal management while maintaining stable operation across the entire temperature range.
The 9.3 V maximum voltage specification allows for flexible power supply configurations in both DC and pulsed operation modes.
Precision-engineered with 2.27 Ohms electrical resistance, the module minimizes joule heating losses while maximizing coefficient of performance (COP).
Rated for 150°C operation, this robust module maintains stable performance in extreme environments where conventional thermal solutions fail.
The Lead Wires, Sealed - Silicone RTV construction enhances reliability through superior environmental protection and electrical isolation characteristics.
Product Attributes
- Product Status: Active
- Size / Dimension: Rectangular - 34.00mm L x 30.00mm W
- Qmax @ Th: 20.9W @ 50°C
- Delta Tmax @ Th: 83.2°C @ 50°C
- Height: 4.14mm
- Number of Stages: -
- Current - Max: 3.8 A
- Voltage - Max: 9.3 V
- Resistance: 2.27 Ohms
- Operating Temperature: 150°C
- Features: Lead Wires, Sealed - Silicone RTV
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