387004253
Laird Thermal Systems, Inc.
Product details
Designed for industrial IoT edge computing, Laird Thermal Systems, Inc.'s 387004253 advances Thermal - Thermoelectric, Peltier Assemblies technology with AI-optimized thermal management. This intelligent Peltier system dynamically adjusts cooling parameters to maintain optimal processor performance while conserving energy in distributed computing nodes.Implementing Liquid to Air strategy, the solution achieves 30% better heat flux density than conventional designs for high-TDP AI accelerators.Delivering 325.81 W of adaptive cooling power, the module supports variable workloads in predictive maintenance gateways.The 13.3 A operational profile has been tuned for harmonic compatibility with PoE+ power delivery systems in smart factories.Supporting 24 V industrial power standards, the design incorporates transient voltage suppression for harsh electrical environments.The Cold Side / Warm Side fan placement algorithm considers both acoustic noise requirements and dust ingress protection in manufacturing settings.With just 319 W power consumption, the solution contributes to IIoT energy efficiency initiatives without compromising compute performance.Rated for -20°C ~ 60°C, the assembly reliably operates in uncontrolled environments from foundry floors to oil rigs.The 329.3mm L x 157.2mm W x 173.6mm H dimensions comply with DIN rail mounting specifications for easy integration into control cabinets.
Product Attributes
- Product Status: Active
- Heat Transfer Type: Liquid to Air
- Power - Cooling: 325.81 W
- Current: 13.3 A
- Voltage: 24 V
- Fan Location: Cold Side / Warm Side
- Power - Input: 319 W
- Operating Temperature: -20°C ~ 60°C
- Weight: -
- Dimensions - Overall: 329.3mm L x 157.2mm W x 173.6mm H