380-90-119-00-001000
Mill-Max Manufacturing Corp.
380-90-119-00-001000
Mill-Max Manufacturing Corp.
CONN HDR SOLDER 19POS TIN-LEAD
Reference Price (USD)
1+
$16.79320
500+
$16.625268
1000+
$16.457336
1500+
$16.289404
2000+
$16.121472
2500+
$15.95354
Exquisite packaging
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380-90-119-00-001000
$16.79
Product details
Optimized for quantum computing infrastructure, Mill-Max Manufacturing Corp.'s 380-90-119-00-001000 Rectangular Connectors - Headers, Specialty Pin delivers cryogenic performance at millikelvin temperatures. This breakthrough solution addresses the unique signal integrity challenges of qubit control systems.The Header architecture maintains <0.01dB insertion loss at 4K temperatures for superconducting circuit interconnects.Utilizing Solder Cup physics, the contacts achieve zero-insertion-force mating required for vibration-sensitive dilution refrigerators.Available in 19 configurations, supporting both DC bias and microwave control lines in quantum processor packaging.0.100" (2.54mm) sub-millimeter pitch enables high-density interconnects while preventing parasitic capacitance in qubit readout circuits.The 1 row design minimizes magnetic flux trapping in superconducting quantum interference devices (SQUIDs).Through Hole variant incorporates non-magnetic materials to prevent qubit decoherence from stray fields.Solder process achieves <1nV/ Hz noise floor for sensitive spin qubit measurements.Tin-Lead surface treatment prevents anomalous heating effects in microwave resonator couplings.The 200.0µin (5.08µm) coating maintains consistent thermal contraction properties from 300K to 10mK.Black housing material demonstrates <1ppm outgassing in ultra-high vacuum cryostats.
Product Attributes
- Product Status: Active
- Connector Type: Header
- Contact Type: Solder Cup
- Number of Positions: 19
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Tin-Lead
- Contact Finish Thickness: 200.0µin (5.08µm)
- Color: Black
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