380-40-133-00-001000
Mill-Max Manufacturing Corp.
380-40-133-00-001000
Mill-Max Manufacturing Corp.
CONN HDR SOLDER 33POS TIN
Reference Price (USD)
1+
$17.57380
500+
$17.398062
1000+
$17.222324
1500+
$17.046586
2000+
$16.870848
2500+
$16.69511
Exquisite packaging
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380-40-133-00-001000
$17.57
Product details
Optimized for quantum computing infrastructure, Mill-Max Manufacturing Corp.'s 380-40-133-00-001000 Rectangular Connectors - Headers, Specialty Pin delivers cryogenic performance at millikelvin temperatures. This breakthrough solution addresses the unique signal integrity challenges of qubit control systems.The Header architecture maintains <0.01dB insertion loss at 4K temperatures for superconducting circuit interconnects.Utilizing Solder Cup physics, the contacts achieve zero-insertion-force mating required for vibration-sensitive dilution refrigerators.Available in 33 configurations, supporting both DC bias and microwave control lines in quantum processor packaging.0.100" (2.54mm) sub-millimeter pitch enables high-density interconnects while preventing parasitic capacitance in qubit readout circuits.The 1 row design minimizes magnetic flux trapping in superconducting quantum interference devices (SQUIDs).Through Hole variant incorporates non-magnetic materials to prevent qubit decoherence from stray fields.Solder process achieves <1nV/ Hz noise floor for sensitive spin qubit measurements.Tin surface treatment prevents anomalous heating effects in microwave resonator couplings.The 200.0µin (5.08µm) coating maintains consistent thermal contraction properties from 300K to 10mK.Black housing material demonstrates <1ppm outgassing in ultra-high vacuum cryostats.
Product Attributes
- Product Status: Active
- Connector Type: Header
- Contact Type: Solder Cup
- Number of Positions: 33
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Tin
- Contact Finish Thickness: 200.0µin (5.08µm)
- Color: Black
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