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374324B00035G

Aavid, Thermal Division of Boyd Corporation
374324B00035G Preview
374324B00035G
Aavid, Thermal Division of Boyd Corporation
HEATSINK BGA W/ADHESIVE TAPE
Reference Price (USD)
1+
$2.54000
500+
$2.5146
1000+
$2.4892
1500+
$2.4638
2000+
$2.4384
2500+
$2.413
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
374324B00035G

374324B00035G

$2.54

Product details

Product Attributes

  • Product Status: Active
  • Type: Board Level
  • Package Cooled: BGA, FPGA
  • Attachment Method: Thermal Tape, Adhesive (Included)
  • Shape: Square, Pin Fins
  • Length: 1.063" (27.00mm)
  • Width: 1.063" (27.00mm)
  • Diameter: -
  • Fin Height: 0.394" (10.00mm)
  • Power Dissipation @ Temperature Rise: 3.0W @ 90°C
  • Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 30.60°C/W
  • Material: Aluminum
  • Material Finish: Black Anodized

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