370-90-110-00-001000
Mill-Max Manufacturing Corp.
370-90-110-00-001000
Mill-Max Manufacturing Corp.
CONN HDR TURRET 10POS TIN-LEAD
Reference Price (USD)
1+
$13.30560
500+
$13.172544
1000+
$13.039488
1500+
$12.906432
2000+
$12.773376
2500+
$12.64032
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
370-90-110-00-001000
$13.31
Product details
Mill-Max Manufacturing Corp.'s 370-90-110-00-001000 represents the gold standard in Rectangular Connectors - Headers, Specialty Pin technology, optimized for next-generation 5G infrastructure. This advanced interconnect solution combines millimeter-wave performance with ruggedized construction for outdoor base station deployments.The Header architecture supports 25Gbps data rates when implemented with matched impedance PCB layouts.Utilizing Turret contact geometry, the design minimizes skin effect losses at microwave frequencies up to 40GHz.Scalable from 10 positions, the connector family addresses diverse MIMO antenna array configurations.Precision 0.100" (2.54mm) alignment enables error-free blind mating in rack-mounted RF equipment installations.Dual-row (1 rows) configuration reduces connector footprint by 40% compared to traditional designs.Through Hole variant features integrated shielding cans for EMI suppression in dense cellular radio units.Solder process achieves <0.5dB insertion loss variance across production batches.Tin-Lead surface treatment prevents fretting corrosion in high-humidity environments.The 200.0µin (5.08µm) coating withstands 500+ thermal shock cycles from -55 C to 125 C.Black housing material demonstrates <0.1% water absorption for marine electronics applications.
Product Attributes
- Product Status: Active
- Connector Type: Header
- Contact Type: Turret
- Number of Positions: 10
- Pitch: 0.100" (2.54mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Tin-Lead
- Contact Finish Thickness: 200.0µin (5.08µm)
- Color: Black
You May Also Be Interested In