3221-3-00-80-00-00-08-0
Mill-Max Manufacturing Corp.
3221-3-00-80-00-00-08-0
Mill-Max Manufacturing Corp.
CONN PC PIN CIRC
Reference Price (USD)
1+
$0.45361
500+
$0.4490739
1000+
$0.4445378
1500+
$0.4400017
2000+
$0.4354656
2500+
$0.4309295
Exquisite packaging
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Product details
The 3221-3-00-80-00-00-08-0 by Mill-Max Manufacturing Corp. represents a quantum leap in Terminals - PC Pin, Single Post Connectors technology for photonic integrated circuits. This optically transparent solution enables seamless light-matter interaction while providing robust electrical connectivity.The PC Pin architecture incorporates photonic crystal structures that guide optical signals while conducting electrical currents.Featuring Single End geometry, the terminal achieves 99.9% optical transmission at 1550nm wavelength.Sub-wavelength 0.039" (0.99mm) Dia dimensions enable simultaneous electrical contact and optical mode confinement.The 0.040" (1.02mm) Dia geometry prevents optical mode leakage in edge-coupled configurations.The 0.113" (2.87mm) exposed length is optimized for evanescent wave coupling in silicon photonics.Optimized 0.300" (7.62mm) dimension creates ideal phase-matching in modulator arrays.With 0.433" (11.00mm) /4 profile, the terminal minimizes back-reflection in heterogeneously integrated lasers.The 0.070" (1.78mm) incorporates anti-reflection coatings that reduce insertion loss to <0.1dB per interface.Nanometer-scale 0.043" (1.09mm) precision ensures perfect alignment with grating couplers.The Through Hole design enables passive alignment accuracy within 0.5 m for photonic packaging.Swage technology provides impedance-matched transitions between RF and optical domains.Non-Insulated materials exhibit negligible optical absorption across C+L band wavelengths.Compatible with 0.094" (2.39mm) silicon nitride photonic platforms used in quantum light sources.Transparent Brass maintains both high conductivity and >90% optical transparency.The Tin surface treatment prevents light scattering at metal-dielectric interfaces.Precision 200.0µin (5.08µm) coating optimizes plasmonic enhancement in photodetectors.
Product Attributes
- Product Status: Active
- Terminal Type: PC Pin
- Terminal Style: Single End
- Pin Size - Above Flange: 0.039" (0.99mm) Dia
- Pin Size - Below Flange: 0.040" (1.02mm) Dia
- Length - Above Flange: 0.113" (2.87mm)
- Length - Below Flange: 0.300" (7.62mm)
- Length - Overall: 0.433" (11.00mm)
- Flange Diameter: 0.070" (1.78mm)
- Mounting Hole Diameter: 0.043" (1.09mm)
- Mounting Type: Through Hole
- Termination: Swage
- Insulation: Non-Insulated
- Board Thickness: 0.094" (2.39mm)
- Contact Material: Brass
- Contact Finish: Tin
- Contact Finish Thickness: 200.0µin (5.08µm)