32-6625-70
Aries Electronics
32-6625-70
Aries Electronics
CONN HDR DIP POST 32POS TIN
Reference Price (USD)
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$10.57636
500+
$10.4705964
1000+
$10.3648328
1500+
$10.2590692
2000+
$10.1533056
2500+
$10.047542
Exquisite packaging
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32-6625-70
$10.58
Product details
Aries Electronics's 32-6625-70 represents the gold standard in Rectangular Connectors - Headers, Specialty Pin technology, optimized for next-generation 5G infrastructure. This advanced interconnect solution combines millimeter-wave performance with ruggedized construction for outdoor base station deployments.The DIP, DIL - Header architecture supports 25Gbps data rates when implemented with matched impedance PCB layouts.Utilizing Post contact geometry, the design minimizes skin effect losses at microwave frequencies up to 40GHz.Scalable from 32 positions, the connector family addresses diverse MIMO antenna array configurations.Precision 0.100" (2.54mm) alignment enables error-free blind mating in rack-mounted RF equipment installations.Dual-row (2 rows) configuration reduces connector footprint by 40% compared to traditional designs.Engineered with 0.600" (15.24mm) spacing, the design maintains 50 characteristic impedance across all channels.Through Hole variant features integrated shielding cans for EMI suppression in dense cellular radio units.Solder process achieves <0.5dB insertion loss variance across production batches.Tin surface treatment prevents fretting corrosion in high-humidity environments.The 200.0µin (5.08µm) coating withstands 500+ thermal shock cycles from -55 C to 125 C.Black housing material demonstrates <0.1% water absorption for marine electronics applications.
Product Attributes
- Product Status: Active
- Connector Type: DIP, DIL - Header
- Contact Type: Post
- Number of Positions: 32
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.600" (15.24mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Tin
- Contact Finish Thickness: 200.0µin (5.08µm)
- Color: Black
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