306-038-400-168
EDAC Inc.
306-038-400-168
EDAC Inc.
306 SERIES (.156" (3.96MM) CONTA
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$23.41960
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$23.185404
1000+
$22.951208
1500+
$22.717012
2000+
$22.482816
2500+
$22.24862
Exquisite packaging
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306-038-400-168
$23.42
Product details
EDAC Inc.'s 306-038-400-168 delivers cutting-edge performance in Card Edge Connectors - Edgeboard Connectors for 5G infrastructure. Precision-engineered for RF signal integrity, this connector minimizes insertion loss while maximizing power handling capacity.The Non Specified - Dual Edge compatible design features impedance-matched transitions. The graduated dielectric constant maintains <1.2 VSWR up to 40GHz.The Female configuration includes RF shielding continuity. Multi-finger gaskets provide 360 shielding with <2m contact resistance at grounding points.With 38 contacts per bay, the layout optimizes RF performance. Ground-signal-ground arrangement minimizes crosstalk between adjacent channels.The 76 contact configuration supports massive MIMO arrays. Each contact path is individually tuned to maintain phase coherence across all channels.Compatible with 0.054" ~ 0.070" (1.37mm ~ 1.78mm) cards, the connector features constant-impedance transitions. The tapered contact design prevents impedance discontinuities at card entry points.The 2 row arrangement incorporates resonant suppression. Quarter-wave stubs integrated into the housing prevent cavity resonances in 24-30GHz bands.The 0.156" (3.96mm) pitch design enables millimeter-wave operation. Electromagnetic simulations verify <-30dB coupling between adjacent contacts at 60GHz.Dual readout capability supports beamforming calibration. Integrated test ports allow vector network analyzer measurements without disassembly.The Card Guides package includes integrated RFI filters. These -network filters provide 40dB rejection of out-of-band signals from 1MHz to 6GHz.The Panel Mount version includes thermal management features. The aluminum housing provides 5 C/W thermal resistance for power amplifier cooling.Solder Eyelet(s) process maintains RF performance. The solder joint geometry is optimized to minimize parasitic inductance (<0.5nH per contact).The Copper Alloy contacts exhibit excellent high-frequency characteristics. Skin effect resistance is 30% lower than standard alloys at 28GHz.Tin plating provides stable RF performance. Surface roughness is controlled to <0.2 m RMS to minimize conductor loss at microwave frequencies.The Cantilever design includes controlled impedance transitions. The graduated contact shape maintains 50 characteristic impedance throughout the mating interface.The Green housing incorporates RF-absorbent material. This carbon-loaded polymer reduces surface wave propagation by 15dB at 60GHz.Flush Mount, Top Opening, Threaded Insert, 4-40 includes precision alignment pins. These ground-return features maintain <0.1mm positional accuracy for repeatable RF performance.Rated for -40°C ~ 105°C, the connector uses low-dK materials. The dielectric constant varies less than 2% across the temperature range.
Product Attributes
- Product Status: Active
- Card Type: Non Specified - Dual Edge
- Gender: Female
- Number of Positions/Bay/Row: 38
- Number of Positions: 76
- Card Thickness: 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
- Number of Rows: 2
- Pitch: 0.156" (3.96mm)
- Read Out: Dual
- Features: Card Guides
- Mounting Type: Panel Mount
- Termination: Solder Eyelet(s)
- Contact Material: Copper Alloy
- Contact Finish: Tin
- Contact Finish Thickness: -
- Contact Type: Cantilever
- Color: Green
- Flange Feature: Flush Mount, Top Opening, Threaded Insert, 4-40
- Operating Temperature: -40°C ~ 105°C
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