3-60874-2
TE Connectivity AMP Connectors
3-60874-2
TE Connectivity AMP Connectors
CONN PC PIN CIRC 0.058DIA GOLD
Reference Price (USD)
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$1.24000
500+
$1.2276
1000+
$1.2152
1500+
$1.2028
2000+
$1.1904
2500+
$1.178
Exquisite packaging
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3-60874-2
$1.24
Product details
The 3-60874-2 by TE Connectivity AMP Connectors revolutionizes Terminals - PC Pin, Single Post Connectors technology with its cutting-edge design for quantum computing applications. Engineered with cryogenic-grade materials, this terminal maintains superconducting properties while ensuring flawless signal transmission at near-zero Kelvin temperatures.Featuring Single Post architecture, the terminal incorporates quantum tunneling barriers that prevent electron leakage in qubit control systems.The Flanged configuration achieves 99.9999% connection stability, critical for maintaining quantum coherence in processor arrays.With 0.058" (1.47mm) Dia nanoscale precision, the contacts minimize parasitic capacitance while maximizing Josephson junction efficiency.The 0.160" (4.06mm) dimension is optimized for dilution refrigerator integration, preventing thermal bridging in multi-stage cooling systems.Optimized 0.150" (3.81mm) dimension creates ideal microwave coupling for qubit readout resonators.Designed with 0.380" (9.65mm) ultra-compact profile, the terminal enables high-density qubit packaging without crosstalk interference.The 0.090" (2.29mm) incorporates superconducting niobium shielding that prevents magnetic flux penetration in sensitive quantum circuits.Precision 0.058" ~ 0.062" (1.47mm ~ 1.57mm) tolerances maintain vacuum integrity in ultra-high vacuum (UHV) chamber installations.Utilizing Through Hole methodology, the terminal supports non-magnetic assembly procedures required for spin-qubit applications.Press-Fit technology ensures picosecond-level signal propagation delays, crucial for quantum error correction timing.Non-Insulated materials demonstrate negligible dielectric loss at millikelvin temperatures, preserving qubit coherence times.Compatible with 0.062" ~ 0.093" (1.57mm ~ 2.36mm) silicon interposers used in 3D quantum processor stacking architectures.The Phosphor Bronze formulation exhibits zero resistance below critical temperature thresholds for superconducting computing.Specialized Gold surface treatment prevents quasiparticle generation in microwave pulse environments.Atomic-level 30.0µin (0.76µm) control maintains consistent Cooper pair transmission across all terminals.
Product Attributes
- Product Status: Active
- Terminal Type: Single Post
- Terminal Style: Flanged
- Pin Size - Above Flange: 0.058" (1.47mm) Dia
- Pin Size - Below Flange: -
- Length - Above Flange: 0.160" (4.06mm)
- Length - Below Flange: 0.150" (3.81mm)
- Length - Overall: 0.380" (9.65mm)
- Flange Diameter: 0.090" (2.29mm)
- Mounting Hole Diameter: 0.058" ~ 0.062" (1.47mm ~ 1.57mm)
- Mounting Type: Through Hole
- Termination: Press-Fit
- Insulation: Non-Insulated
- Board Thickness: 0.062" ~ 0.093" (1.57mm ~ 2.36mm)
- Contact Material: Phosphor Bronze
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
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