3-331368-9
TE Connectivity AMP Connectors
3-331368-9
TE Connectivity AMP Connectors
CONN SOCKET CONTACT BNC CRMP GLD
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Product details
TE Connectivity AMP Connectors's 3-331368-9 revolutionizes Coaxial Connectors (RF) - Contacts technology for high-performance computing infrastructure. This ultra-high-speed contact solution delivers unprecedented signal integrity for AI server clusters and data center interconnect applications.The 0.031" (0.79mm) precision supports millimeter-wave signaling. The 0.025" (0.64mm) version maintains 90 differential impedance.The Crimp methodology achieves <0.5ps skew in differential pairs. The press-fit design maintains impedance control for 56Gbps NRZ signaling.HPC-optimized Socket geometry minimizes crosstalk in dense configurations. The shielded twinax design provides >40dB isolation at 28GHz.As a BNC connector leader in data center technology, this component meets OCP NIC 3.0 specifications. The QSFP-DD variant supports 800G Ethernet standards.The Free Hanging (In-Line) options support high-density server architectures. Mid-board configurations enable direct ASIC-to-ASIC connections.HPC-grade Beryllium Copper includes low-loss dielectric composites. Liquid crystal polymer insulation minimizes dielectric absorption.The Gold layer formulation reduces skin effect losses. 15 m gold over 50 m nickel plating ensures <0.3dB/inch loss at 50GHz.HPC-optimized 100.0µin (2.54µm) balances performance and cost. The selective 30.0 in (0.76 m) gold plating meets 25Gbps+ requirements.
Product Attributes
- Product Status: Obsolete
- Cable Group: -
- Center Conductor Diameter: 0.031" (0.79mm)
- Wire Gauge: -
- Contact Termination: Crimp
- Pin or Socket: Socket
- Type: BNC
- Mounting Type: Free Hanging (In-Line)
- Impedance: -
- Contact Material: Beryllium Copper
- Contact Finish: Gold
- Contact Finish Thickness: 100.0µin (2.54µm)
- Features: -
- Board Thickness: -
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