3-173983-2
TE Connectivity AMP Connectors
3-173983-2
TE Connectivity AMP Connectors
CONN WIR IDC 12P 26-28AWG PCB RA
Reference Price (USD)
1+
$0.83695
500+
$0.8285805
1000+
$0.820211
1500+
$0.8118415
2000+
$0.803472
2500+
$0.7951025
Exquisite packaging
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3-173983-2
$0.84
Product details
The 3-173983-2 from TE Connectivity AMP Connectors represents a breakthrough in Rectangular Connectors - Board In, Direct Wire to Board technology for high-speed computing applications. Optimized for signal integrity at multi-gigabit data rates, this connector series enables next-generation server architectures and data center interconnects.The Individual Wires design incorporates advanced crosstalk suppression techniques that maintain signal purity at 56Gbps PAM4 signaling, critical for high-performance computing and AI accelerator applications.Available in 12 configurations, this connector family supports the growing bandwidth requirements of server backplanes, from traditional 1U servers to hyper-scale data center architectures.Precision 0.079" (2.00mm) alignment maintains consistent differential pair geometry, critical for minimizing skew in 112G PAM4 signaling used in next-generation data center interconnects.The 0.079" (2.00mm) board interface supports high-density PCB designs with microvia technology, enabling compact routing of 400G Ethernet switch fabrics.The 1-row architecture optimizes signal density while minimizing insertion loss, enabling higher port counts in top-of-rack switches and router line cards.Through Hole, Right Angle mounting ensures reliable connections in vibration-prone data center environments while supporting high-volume automated assembly processes for mass production.Utilizing IDC technology, the connector achieves consistent impedance matching across all contacts, reducing signal reflections in 400G Ethernet and InfiniBand EDR applications.Compatible with 26-28 AWG wiring, the connector accommodates both high-speed differential pairs and power delivery requirements in blade server systems and storage arrays.Tin plating provides optimal surface properties for high-frequency signal transmission while resisting wear in frequently mated data center applications.The Yellow housing facilitates quick visual identification in dense server racks while meeting flammability requirements for confined data center environments.
Product Attributes
- Product Status: Active
- Connector Type: Individual Wires
- Number of Positions: 12
- Cable Pitch: 0.079" (2.00mm)
- Board-Side Pitch: 0.079" (2.00mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole, Right Angle
- Cable Termination: IDC
- Wire Gauge: 26-28 AWG
- Features: -
- Contact Finish: Tin
- Contact Finish Thickness: -
- Color: Yellow
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