2746327

Bergquist's 2746327 sets new benchmarks in Thermal - Adhesives, Epoxies, Greases, Pastes technology, specifically developed for mission-critical thermal management. This innovative formulation combines exceptional thermal transfer capabilities with robust mechanical stability, making it indispensable for next-generation electronic designs.Classified as Silicone Gel, this thermal interface material exhibits unique self-leveling properties. Unlike standard compounds, its thixotropic behavior ensures optimal surface wetting while preventing pump-out effects in vibration-prone environments.The 0.8 gal Pail packaging configuration enables precise dispensing for automated assembly processes. This dimensional optimization reduces material waste by up to 30% compared to traditional packaging formats.Engineered to withstand -76°F ~ 392°F (-60°C ~ 200°C), this material demonstrates exceptional thermal stability. Its proprietary formulation prevents dry-out or cracking even after prolonged thermal cycling.Red coloration provides immediate visual confirmation of proper application thickness. This chromatic feature is particularly valuable in high-density PCB assemblies where inspection access is limited.Delivering 10.00W/m-K thermal conductivity, this compound establishes new efficiency standards. Its advanced filler technology creates optimal thermal pathways while maintaining electrical insulation properties.The guaranteed 6 Months shelf life exceeds industry norms, reducing inventory turnover costs. When stored within {Storage/Refrigeration Temperature} parameters, the material maintains consistent performance characteristics.Maintain product integrity by adhering to 32°F ~ 95°F (0°C ~ 35°C) storage conditions. This preservation protocol prevents premature curing and maintains optimal viscosity for application.