260-5204-01
3M
260-5204-01
3M
CONN SOCKET QFN 60POS GOLD
Reference Price (USD)
1+
$121.35000
500+
$120.1365
1000+
$118.923
1500+
$117.7095
2000+
$116.496
2500+
$115.2825
Exquisite packaging
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260-5204-01
$121.35
Product details
The 260-5204-01 from 3M delivers laboratory-grade precision for Sockets for ICs, Transistors applications in test and measurement equipment. The ultra-stable design ensures <0.1% measurement uncertainty over 10,000 mating cycles.Featuring QFN configuration, the socket provides 10^14 insulation resistance. Guarded measurements confirm <1pA leakage current at 1000V for sensitive instrumentation.With 60 (4 x 15), the socket supports high-precision metrology. The symmetrical layout minimizes thermocouple effects to <0.1 V/ C.0.020" (0.50mm) spacing achieves optimal noise rejection. Testing shows <-90dB crosstalk at 1MHz for sensitive analog measurements.The Gold finish provides stable thermoelectric properties. Testing confirms <0.5 V contact potential variation over temperature.Constructed with Beryllium Copper, the socket minimizes magnetic interference. Testing shows <0.1 T field distortion at 1mm distance.The Through Hole design prevents microphonic noise. Testing confirms <1 V vibration-induced noise in sensitive amplifier circuits.Incorporating Open Frame, the socket provides Faraday cage shielding. Testing shows >100dB RF isolation up to 10GHz for precision measurements.Solder technology ensures negligible insertion loss. Network analyzer measurements show <0.01dB loss at 6GHz for RF test applications.The 0.020" (0.50mm) spacing accommodates precision coaxial connections. Testing confirms <0.05mm positional accuracy for microwave probe stations.Gold plating prevents surface oxidation. XPS analysis shows <1nm oxide growth after 1000 hours in cleanroom environments.The Beryllium Copper posts maintain dimensional stability. Interferometer measurements show <10nm flatness variation over temperature.Polyethersulfone (PES) housing material provides ultra-low outgassing. RGA testing shows <1 10^-9 Torr total mass loss for vacuum applications.
Product Attributes
- Product Status: Active
- Type: QFN
- Number of Positions or Pins (Grid): 60 (4 x 15)
- Pitch - Mating: 0.020" (0.50mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.020" (0.50mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -
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