25EMPPC603EBC-166
IBM
25EMPPC603EBC-166
IBM
IBM25EMPPC603 - POWERPC 603E
Reference Price (USD)
1+
$35.80000
500+
$35.442
1000+
$35.084
1500+
$34.726
2000+
$34.368
2500+
$34.01
Exquisite packaging
Discount
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25EMPPC603EBC-166
$35.80
Product details
The 25EMPPC603EBC-166 from IBM delivers military-grade reliability in the Embedded - Microprocessors category, hardened for aerospace and defense applications. This radiation-hardened microprocessor combines triple-modular redundancy with error-correcting architectures, meeting MIL-STD-883 requirements for mission-critical systems.Featuring a PowerPC EM603e radiation-hardened core, the processor implements lockstep execution with cycle-by-cycle comparison for fault detection.The 1 Core, 32-Bit configuration includes redundant execution units for single-event upset mitigation in space applications.Operating at 166MHz, the device meets the real-time processing requirements of spacecraft attitude control systems.No display controllers include radiation-hardened frame buffers for critical spacecraft displays.2.5V, 3.3V tolerant I/Os withstand transient voltage spikes common in military electrical systems.Qualified for 0°C ~ 105°C (TJ) operation, the processor functions in extreme space and high-altitude environments.The 278-BBGA, FCBGA package implements hermetic sealing for protection against moisture and contaminants.Available in 278-FCPBGA (21x21), the device supports military-grade PCB assembly processes.
Product Attributes
- Product Status: Active
- Core Processor: PowerPC EM603e
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 166MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TJ)
- Security Features: -
- Package / Case: 278-BBGA, FCBGA
- Supplier Device Package: 278-FCPBGA (21x21)
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