25EMPPC603E2BB200K
IBM
25EMPPC603E2BB200K
IBM
IBM25EMPPC603 - POWERPC 603E
Reference Price (USD)
1+
$31.54000
500+
$31.2246
1000+
$30.9092
1500+
$30.5938
2000+
$30.2784
2500+
$29.963
Exquisite packaging
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25EMPPC603E2BB200K
$31.54
Product details
IBM's 25EMPPC603E2BB200K revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The PowerPC EM603e core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 1 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 200MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.No graphics capabilities enable visualization of network performance metrics in real-time.2.5V, 3.3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for 0°C ~ 105°C (TJ) operation, the processor maintains performance in outdoor radio unit installations.The 278-BBGA, FCBGA package design optimizes thermal performance for continuous high-load operation.Available in 278-FCPBGA (21x21), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Active
- Core Processor: PowerPC EM603e
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 200MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TJ)
- Security Features: -
- Package / Case: 278-BBGA, FCBGA
- Supplier Device Package: 278-FCPBGA (21x21)
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