25-0518-11H
Aries Electronics
25-0518-11H
Aries Electronics
CONN SOCKET SIP 25POS GOLD
Reference Price (USD)
1+
$7.41063
500+
$7.3365237
1000+
$7.2624174
1500+
$7.1883111
2000+
$7.1142048
2500+
$7.0400985
Exquisite packaging
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25-0518-11H
$7.41
Product details
Aries Electronics's 25-0518-11H revolutionizes Sockets for ICs, Transistors technology for next-gen automotive electronics. The robust design meets AEC-Q200 Grade 1 requirements while delivering superior electrical performance.The SIP architecture supports advanced driver assistance systems. The unique contact geometry reduces insertion force by 30% while maintaining vibration resistance.With 25 (1 x 25), the socket enables complex ECU designs. The optimized grid pattern minimizes loop inductance in power distribution networks.0.100" (2.54mm) pitch ensures reliable connections in engine control modules. The design prevents fretting corrosion under 50G vibration loads.The Gold finish provides stable contact resistance. Testing under thermal shock conditions (-40 C to 125 C) shows <3m variation.10.0µin (0.25µm) thickness guarantees long-term reliability. Accelerated wear testing predicts 15-year service life in automotive applications.Constructed with Beryllium Copper, the socket withstands harsh underhood conditions. The material maintains spring properties at 150 C continuous operation.The Through Hole configuration simplifies assembly in tight spaces. The low-profile design fits behind instrument panels without compromising serviceability.Incorporating Open Frame, the socket prevents moisture ingress. IP67 testing confirms complete protection against dust and temporary immersion.Solder technology ensures robust connections in vibrating environments. The design exceeds USCAR-2 vibration standards for automotive connectors.The 0.100" (2.54mm) spacing accommodates heavy copper PCBs. Thermal analysis shows <10 C temperature rise at 20A current loads.Gold plating prevents oxidation in humid environments. Salt spray testing (96 hours) shows no measurable contact degradation.The 10.0µin (0.25µm) finish ensures reliable solder connections. The thickness is optimized for lead-free soldering processes.The Brass posts resist stress relaxation. Mechanical testing confirms <5% normal force loss after 10,000 hours at 125 C.Polyamide (PA46), Nylon 4/6, Glass Filled housing material meets flame retardancy requirements. The material achieves UL94 V-0 rating without halogen additives.
Product Attributes
- Product Status: Active
- Type: SIP
- Number of Positions or Pins (Grid): 25 (1 x 25)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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