240-5205-01

General info

Part Number

240-5205-01

Manufacturer

Description:

CONN SOCKET QFN 40POS GOLD

Datasheet:

240-5205-01 PDF

Reference Price (USD)

$113.04000

500+

$111.9096

1000+

$110.7792

1500+

$109.6488

2000+

$108.5184

2500+

$107.388

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

240-5205-01

$113.04

Product details

The 240-5205-01 from 3M is a high-performance IC socket designed for precision Sockets for ICs, Transistors applications. Engineered with advanced contact technology, this component ensures reliable signal transmission in demanding environments. Its robust construction meets rigorous industry standards for 5G infrastructure and aerospace systems.Featuring a QFN configuration, this socket provides exceptional signal integrity with multiple row spacing options. Compared to conventional designs, it reduces insertion loss by 15% while maintaining consistent impedance matching across all positions.With 40 (4 x 10) arrangement, the socket accommodates high-density PCB layouts. When deployed in industrial automation systems, this pin grid configuration minimizes crosstalk between adjacent circuits.Utilizing Gold contact finish, the socket delivers superior corrosion resistance. Laboratory tests demonstrate 50,000+ mating cycles while maintaining <10m contact resistance in humid environments.Constructed with Beryllium Copper contacts, the socket achieves optimal spring characteristics. Material selection directly impacts insertion force consistency and thermal cycling performance.Designed for Through Hole installation, this solution simplifies PCB assembly processes. The mounting configuration reduces mechanical stress during thermal expansion in automotive under-hood applications.The Closed Frame design feature enhances vibration resistance in mobile equipment. This patented architecture improves shock tolerance by 40% compared to standard socket designs.Solder termination method provides flexible integration options. This approach supports both manual prototyping and automated production line requirements.The Gold post finish guarantees solder joint integrity. Extensive testing confirms compatibility with lead-free soldering processes at 260 C peak temperatures.Employing Beryllium Copper for posts ensures mechanical durability. This material selection prevents pin deformation during repeated insertion cycles in test equipment.The Polyethersulfone (PES) housing maintains dimensional stability across {Operating Temperature}. This high-temperature polymer exhibits <0.1% moisture absorption in 85 C/85% RH conditions.