24-6554-16
Aries Electronics
24-6554-16
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS
Reference Price (USD)
1+
$48.69000
500+
$48.2031
1000+
$47.7162
1500+
$47.2293
2000+
$46.7424
2500+
$46.2555
Exquisite packaging
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24-6554-16
$48.69
Product details
Designed for mission-critical systems, 24-6554-16 by Aries Electronics sets new standards in Sockets for ICs, Transistors technology. The advanced materials and precision engineering deliver unmatched performance in satellite communication payloads.The DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing configuration supports multi-GHz signal transmission. Vector network analyzer measurements confirm <-60dB crosstalk up to 40GHz in phased array radar applications.The 24 (2 x 12) layout enables efficient heat dissipation. Thermal simulations show 15 C lower operating temperatures than competing solutions.0.100" (2.54mm) spacing achieves optimal impedance control. Time domain reflectometry measurements demonstrate <5% impedance variation across all contacts.Featuring Nickel Boron finish, the socket maintains stable contact resistance. Testing under 95% RH conditions shows <2m variation over 1,000 hours.The 50.0µin (1.27µm) coating provides exceptional durability. Wear testing indicates <0.5 m material loss after 25,000 insertion cycles.Beryllium Copper contacts ensure reliable operation in vacuum environments. The material outgassing rate meets NASA ASTM E595 requirements.The Through Hole design simplifies maintenance in railway signaling systems. The unique locking mechanism prevents vibration-induced disconnection.With Closed Frame, the socket achieves EMI shielding effectiveness >60dB. This meets MIL-STD-461G requirements for sensitive military electronics.Solder method enables high-speed signal integrity. Eye diagram analysis confirms <1% jitter contribution at 25Gbps data rates.The 0.100" (2.54mm) post spacing accommodates high-voltage applications. Dielectric testing confirms 2.5kV isolation between adjacent posts.Nickel Boron plating prevents whisker growth in humid environments. This addresses JEDEC JESD22-A121 compliance requirements.The 50.0µin (1.27µm) finish ensures perfect solder joints. Cross-section analysis reveals 100% intermetallic coverage in reflow processes.The Beryllium Copper posts withstand repeated thermal cycling. Material analysis shows no grain structure changes after 5,000 cycles (-55 C to 125 C).Polyphenylene Sulfide (PPS), Glass Filled housing material offers exceptional chemical resistance. The material withstands immersion in hydraulic fluids and jet fuels.
Product Attributes
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Nickel Boron
- Contact Finish Thickness - Mating: 50.0µin (1.27µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Nickel Boron
- Contact Finish Thickness - Post: 50.0µin (1.27µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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