24-6553-18
Aries Electronics
24-6553-18
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS
Reference Price (USD)
1+
$91.78900
500+
$90.87111
1000+
$89.95322
1500+
$89.03533
2000+
$88.11744
2500+
$87.19955
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
24-6553-18
$91.79
Product details
Aries Electronics's 24-6553-18 sets new benchmarks for Sockets for ICs, Transistors components in renewable energy systems. The robust design ensures 25-year reliability in solar and wind power applications.The DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing architecture provides lightning surge protection. Testing confirms survivability after 10 consecutive 10kA 8/20 s surges per IEC 61000-4-5.With 24 (2 x 12), the socket enables high-current power conversion. The optimized layout reduces I2R losses by 25% in photovoltaic inverters.0.100" (2.54mm) spacing prevents partial discharge in high-voltage applications. Testing shows no PD activity below 2.5kV in humid conditions.Featuring Nickel Boron finish, the socket resists sulfur corrosion. Testing in H2S environments shows no degradation after 1000 hours.The 50.0µin (1.27µm) coating withstands UV degradation. Accelerated weathering tests predict 25-year performance in direct sunlight.Constructed with Beryllium Nickel, the socket handles thermal cycling. Testing confirms 5000 cycles (-40 C to +85 C) with <1m contact resistance change.The Through Hole design resists wind-induced vibration. Testing confirms no loosening after 10^7 cycles at 0.5mm amplitude.Incorporating Closed Frame, the socket prevents PID (Potential Induced Degradation). Testing shows <1% power loss in 1000V biased damp heat conditions.Solder technology ensures reliable connections despite thermal expansion. Testing confirms <0.1mm movement during 100 C temperature swings.The 0.100" (2.54mm) spacing accommodates heavy busbar connections. Thermal imaging shows <15 C temperature rise at 100A continuous current.Nickel Boron plating prevents fretting in vibrating environments. Testing shows <2m change after 10^8 micro-motions.The 50.0µin (1.27µm) finish ensures reliable connections despite thermal cycling. Testing shows no degradation after 1000 -40 C/+105 C cycles.The Beryllium Nickel posts resist stress relaxation. Testing confirms <3% contact force loss after 25 years at 70 C.Polyetheretherketone (PEEK), Glass Filled housing material provides tracking resistance. The material achieves CTI 600 for high-pollution environments.Rated for -55°C ~ 250°C, the socket performs in extreme weather. Testing confirms operation from -40 C to +105 C with 95% RH.
Product Attributes
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Nickel Boron
- Contact Finish Thickness - Mating: 50.0µin (1.27µm)
- Contact Material - Mating: Beryllium Nickel
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Nickel Boron
- Contact Finish Thickness - Post: 50.0µin (1.27µm)
- Contact Material - Post: Beryllium Nickel
- Housing Material: Polyetheretherketone (PEEK), Glass Filled
- Operating Temperature: -55°C ~ 250°C
You May Also Be Interested In