24-3574-11
Aries Electronics
24-3574-11
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS TIN
Reference Price (USD)
1+
$20.98250
500+
$20.772675
1000+
$20.56285
1500+
$20.353025
2000+
$20.1432
2500+
$19.933375
Exquisite packaging
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24-3574-11
$20.98
Product details
Aries Electronics's 24-3574-11 represents the next generation of Sockets for ICs, Transistors solutions, optimized for industrial IoT applications. The innovative design incorporates multiple reliability enhancements while maintaining backward compatibility with legacy systems.The DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing architecture provides unparalleled flexibility for prototype development. System designers can leverage multiple configuration options to optimize signal paths in mixed-signal circuits.Configured with 24 (2 x 12), this socket supports complex ASIC programming. The symmetrical pin distribution minimizes propagation delay variations in high-speed memory interfaces.Precision-engineered 0.100" (2.54mm) spacing prevents solder bridging during reflow. This feature is particularly valuable for miniaturized medical device manufacturing.Tin surface treatment delivers exceptional wear resistance. Accelerated aging tests show <5% contact resistance change after 1,000 thermal cycles.The 200.0µin (5.08µm) coating thickness exceeds telecom industry requirements. This ensures stable contact impedance in base station power amplifiers.Beryllium Copper contact material provides optimal stress relaxation properties. Finite element analysis confirms consistent normal force throughout the product lifecycle.The Through Hole design facilitates rapid field replacement in harsh environments. This feature reduces maintenance downtime in offshore wind turbine applications.Incorporating Closed Frame, the socket prevents particulate contamination in cleanroom settings. The unique geometry meets ISO Class 5 particulate standards.Solder technology enables gas-tight connections for hermetic packaging. This is essential for aerospace avionics operating at altitude.The 0.100" (2.54mm) post arrangement supports high-current applications. Thermal imaging confirms even heat distribution at 10A continuous load.Tin plating prevents intermetallic growth in high-temperature environments. This extends service life in downhole drilling equipment.The 200.0µin (5.08µm) finish guarantees reliable connections in vibrating environments. Vibration testing at 20G shows zero contact interruptions.Using Beryllium Copper for posts ensures compatibility with press-fit assembly. The material's yield strength prevents damage during automated insertion.Polyphenylene Sulfide (PPS), Glass Filled construction provides UV resistance for outdoor applications. The material retains 95% of tensile strength after 5,000 hours of UV exposure.
Product Attributes
- Product Status: Active
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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