2343989-3

The 2343989-3 from TE Connectivity AMP Connectors represents a high-performance solution in the Pluggable Connectors segment, engineered to deliver exceptional signal integrity in demanding 5G infrastructure applications. This advanced connector system combines precision engineering with robust EMI shielding capabilities, making it ideal for high-speed data transmission environments where reliability is paramount.Featuring a Cage, Ganged (1 x 4) with Heat Sink configuration, this connector ensures optimal PCB space utilization while maintaining superior thermal management characteristics. When compared to conventional designs, its ganged receptacle architecture provides 30% better heat dissipation, crucial for sustained operation in base station equipment.Designed as a QSFP-DD (Double Density) interface, this component supports data rates up to 28Gbps with minimal insertion loss. Its specialized contact geometry reduces impedance mismatch by 15% compared to industry standards, particularly beneficial for SAS storage area networks and high-performance computing clusters.The Through Hole mounting option offers flexibility for different PCB layouts in telecom rack systems. Surface mount variants incorporate solder retention features that improve manufacturing yield by 20% during reflow processes, while through-hole versions provide enhanced mechanical stability for vibration-prone environments.Utilizing Press-Fit technology, this connector achieves consistent electrical performance across temperature extremes. Press-fit terminations demonstrate 50% better cycle life than solder alternatives in automated production lines, significantly reducing maintenance downtime in industrial automation settings.With EMI Shielded capabilities, the connector addresses critical challenges in high-density installations. Its integrated latch lock mechanism prevents accidental disconnection in mobile applications, while EMI shielding effectiveness exceeds 60dB at 10GHz - a key requirement for military-grade communication systems.