2319757-1
TE Connectivity AMP Connectors
2319757-1
TE Connectivity AMP Connectors
DUAL LGA,257 POS, DMD SOCKET
Reference Price (USD)
1+
$18.66000
500+
$18.4734
1000+
$18.2868
1500+
$18.1002
2000+
$17.9136
2500+
$17.727
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
2319757-1
$18.66
Product details
TE Connectivity AMP Connectors's 2319757-1 represents the next generation of Sockets for ICs, Transistors solutions, optimized for industrial IoT applications. The innovative design incorporates multiple reliability enhancements while maintaining backward compatibility with legacy systems.The LGA architecture provides unparalleled flexibility for prototype development. System designers can leverage multiple configuration options to optimize signal paths in mixed-signal circuits.Configured with 257 (20 x 30), this socket supports complex ASIC programming. The symmetrical pin distribution minimizes propagation delay variations in high-speed memory interfaces.Precision-engineered 0.039" (1.00mm) spacing prevents solder bridging during reflow. This feature is particularly valuable for miniaturized medical device manufacturing.Gold surface treatment delivers exceptional wear resistance. Accelerated aging tests show <5% contact resistance change after 1,000 thermal cycles.The 3.00µin (0.076µm) coating thickness exceeds telecom industry requirements. This ensures stable contact impedance in base station power amplifiers.Copper Alloy contact material provides optimal stress relaxation properties. Finite element analysis confirms consistent normal force throughout the product lifecycle.The Surface Mount design facilitates rapid field replacement in harsh environments. This feature reduces maintenance downtime in offshore wind turbine applications.Incorporating Board Guide, Open Frame, the socket prevents particulate contamination in cleanroom settings. The unique geometry meets ISO Class 5 particulate standards.Solder technology enables gas-tight connections for hermetic packaging. This is essential for aerospace avionics operating at altitude.Thermoplastic construction provides UV resistance for outdoor applications. The material retains 95% of tensile strength after 5,000 hours of UV exposure.With -25°C ~ 100°C range, the socket operates flawlessly in steel mill controls. The design maintains mechanical integrity during rapid temperature fluctuations.
Product Attributes
- Product Status: Active
- Type: LGA
- Number of Positions or Pins (Grid): 257 (20 x 30)
- Pitch - Mating: 0.039" (1.00mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 3.00µin (0.076µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Surface Mount
- Features: Board Guide, Open Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Thermoplastic
- Operating Temperature: -25°C ~ 100°C
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