2292BG
Aavid, Thermal Division of Boyd Corporation
2292BG
Aavid, Thermal Division of Boyd Corporation
BOARD LEVEL HEAT SINK
Reference Price (USD)
1+
$6.10394
500+
$6.0429006
1000+
$5.9818612
1500+
$5.9208218
2000+
$5.8597824
2500+
$5.798743
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
2292BG
$6.10
Product details
The 2292BG by Aavid, Thermal Division of Boyd Corporation delivers military-grade reliability in the Thermal - Heat Sinks category for satellite communications. This space-qualified thermal solution combines exceptional performance with the ruggedness required for orbital and terrestrial extreme environments.The Dual-Phase Heat Pipe design maintains thermal resistance within 5% variance in zero-g conditions. Unlike conventional solutions, this configuration operates effectively at any orientation with respect to gravity.Engineered for GaN RF power amplifiers, the solution handles {Power Dissipation @ Temperature Rise} in vacuum conditions. The thermal interface maintains stable performance across 500+ thermal cycles from -150 C to +125 C.The Flexure Mount system compensates for CTE mismatches in composite satellite structures. The design maintains thermal contact pressure within 10% across the full operational temperature range.Spiral Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional radiation environments. The geometry maximizes surface area while minimizing molecular contamination risk.For cylindrical transceiver modules, the 0.300" (7.62mm) ID, 1.125" (28.57mm) OD variant provides complete 360 thermal coupling. The design maintains contact pressure in microgravity environments.Rated for 1.5W @ 40°C in orbital conditions, the design includes margin for eclipse operation cycles. Thermal models account for albedo and Earth IR radiation effects.The 8.00°C/W @ 400 LFM performance is qualified for terrestrial use in desert environments. The design prevents sand ingress while maintaining cooling performance.Aluminum 6061-T6 with Type III hard anodize meets MIL-A-8625 requirements. The material outgassing characteristics comply with NASA ASTM E595 standards.Black Anodized surface treatment provides optimal emissivity (0.92) for radiative cooling. The finish withstands atomic oxygen exposure in LEO environments.
Product Attributes
- Product Status: Active
- Type: Board Level
- Package Cooled: BGA
- Attachment Method: Thermal Tape, Adhesive (Not Included)
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 0.300" (7.62mm) ID, 1.125" (28.57mm) OD
- Fin Height: -
- Power Dissipation @ Temperature Rise: 1.5W @ 40°C
- Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: Black Anodized
You May Also Be Interested In