2188863

The 2188863 from Bergquist delivers military-grade Thermal - Pads, Sheets solutions for harsh environment electronics. This extreme-duty thermal interface material meets MIL-STD-810 requirements while providing reliable thermal management for defense and aerospace systems.Engineered for DO-5 in military electronics, this material performs reliably from -55 C to 200 C. When subjected to altitude variations from sea level to 70,000 feet, it maintains consistent thermal interface properties without degradation.As a MIL-spec Pad, Tube, this product combines extreme temperature stability with vibration resistance. The specially formulated matrix withstands 50G mechanical shock while maintaining perfect thermal contact.Precision-manufactured in Round configurations, this material meets tight military tolerances. The laser-cut edges ensure perfect fitment in ruggedized enclosures with strict dimensional requirements.With 25.02mm x 11.00mm dimensions, this solution accommodates standard military electronic packaging. The size-optimized design allows for efficient thermal management in space-constrained armored vehicles and aircraft systems.Featuring ultra-tight 0.0120" (0.305mm) tolerances ( 0.01mm), this material ensures reliable interface contact under vibration. The controlled compression characteristics maintain optimal thermal transfer in dynamic environments.Formulated with mil-spec Silicone Rubber, this pad exhibits exceptional resistance to fuels and hydraulic fluids. This property ensures long-term reliability in engine compartments and weapons systems.The Gray, Green coding system complies with military identification standards. This standardized coloring facilitates quick material verification during field maintenance operations.With military-grade 0.60°C/W performance, this material minimizes thermal gradients in critical defense systems. The result is improved reliability of sensitive electronic warfare equipment.Delivering 0.9W/m-K performance, this material enables effective cooling in armored electronics. The anisotropic properties provide directional heat flow for targeted cooling of high-power components.