2166063

Bergquist's 2166063 establishes new standards in Thermal - Pads, Sheets for renewable energy systems. This high-efficiency thermal solution is engineered specifically for solar inverters and wind turbine power electronics, delivering unmatched reliability in green energy applications.As an environmentally certified Gap Filler Pad, Sheet, this product combines superior thermal transfer with RoHS-compliant materials. The halogen-free composition makes it ideal for sustainable energy applications requiring eco-friendly components.Available in Rectangular configurations, this solution accommodates large-area power modules. The precision-cut profiles ensure optimal coverage of IGBT and MOSFET packages in high-power converters.With 406.40mm x 203.20mm dimensions, this thermal pad fits standard renewable energy enclosure designs. The optimized footprint allows for efficient thermal pathway creation in space-constrained power cabinets.The carefully engineered 0.125" (3.18mm) provides perfect balance between thermal transfer and vibration damping. This characteristic is particularly valuable in wind turbine applications subject to constant mechanical stress.Constructed from weather-resistant Silicone Elastomer, this pad exhibits exceptional performance in humid environments. The hydrophobic formulation prevents moisture absorption that could degrade thermal performance.Featuring Adhesive - One Side properties, this solution offers long-term bonding in variable temperatures. The temperature-resistant formulation maintains adhesion from -40 C to 150 C, covering all climatic conditions.The rugged Sil-Pad provides excellent handling characteristics in field installations. This reinforced backing prevents tearing during manual application in challenging outdoor conditions.The Pink identification system facilitates quick material verification during field maintenance. This outdoor-visible coloring remains legible even after years of environmental exposure.Achieving 1.0W/m-K performance, this material enables more efficient cooling of power semiconductors. The isotropic properties ensure uniform heat distribution across large-area devices.