216-5205-01
3M
216-5205-01
3M
CONN SOCKET QFN 16POS GOLD
Reference Price (USD)
1+
$94.85000
500+
$93.9015
1000+
$92.953
1500+
$92.0045
2000+
$91.056
2500+
$90.1075
Exquisite packaging
Discount
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216-5205-01
$94.85
Product details
The 216-5205-01 from 3M delivers military-grade performance for Sockets for ICs, Transistors applications in defense systems. Designed to exceed MIL-STD-883 requirements, this socket ensures mission success in extreme conditions.Featuring QFN configuration, the socket provides EMP protection for sensitive electronics. Testing confirms survivability in 50kV/m transient electromagnetic fields.With 16 (3x3), the socket supports ruggedized avionics designs. The reinforced grid pattern withstands 100G mechanical shock per MIL-STD-810H.0.020" (0.50mm) spacing maintains signal integrity in jamming environments. Testing shows <-65dB crosstalk despite intentional RF interference.The Gold finish resists corrosion in salt fog. Testing per MIL-STD-202G Method 101 shows no degradation after 1000 hours.Constructed with Beryllium Copper, the socket withstands ballistic impacts. Testing confirms functionality after 30g 11ms half-sine shock pulses.The Through Hole design prevents loosening in vibration. Testing per MIL-STD-167-1 shows zero connection loss at 29Hz-2kHz random vibration.Solder technology ensures reliability in high-altitude conditions. Testing confirms operation at 70,000 feet with <1% contact resistance change.Gold plating prevents galvanic corrosion. Testing in marine environments shows no measurable degradation after 5 years.The Beryllium Copper posts resist stress corrosion cracking. Testing per ASTM G36 shows no cracking after 1000 hours in boiling MgCl2.Polyethersulfone (PES) housing material provides radar absorption. Testing shows -20dB RCS reduction compared to metal housings.
Product Attributes
- Product Status: Active
- Type: QFN
- Number of Positions or Pins (Grid): 16 (3x3)
- Pitch - Mating: 0.020" (0.50mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyethersulfone (PES)
- Operating Temperature: -
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