213500-1

The 213500-1 from TE Connectivity AMP Connectors delivers breakthrough performance in Backplane Connectors - Housings for quantum computing applications. This cryogenic-ready interconnect system maintains signal integrity at temperatures approaching absolute zero while addressing the unique challenges of qubit control and measurement systems.Featuring Housing for Male Pins technology, this solution provides <0.1dB insertion loss at 4K temperatures with minimal thermal loading in dilution refrigerator environments.The Drawer design incorporates superconducting materials that maintain <1m contact resistance at cryogenic temperatures for Josephson junction arrays.With 8 (Coax or Power) filtered signal paths, this interconnect supports parallel qubit control with minimal crosstalk in 50+ qubit processors.The 0.315" (8.00mm) quantum-grade pitch spacing minimizes parasitic capacitance (<0.1pF) critical for preserving qubit coherence times in superconducting circuits.The 3 row configuration enables efficient routing of microwave control lines while maintaining 50 impedance in 3D quantum processor packaging.Designed for Panel Mount installation, this connector features zero-thermal-expansion materials that prevent microphonic effects in sensitive quantum measurement systems.As Receptacle, this component provides ultra-high vacuum compatibility (<10^-10 Torr) required for trapped ion quantum computer interconnects.The Mating Guide package includes magnetic shielding that reduces stray field interference below 1 T for spin-based quantum computing architectures.The Black housing material exhibits negligible outgassing properties while providing visual contrast for optical qubit alignment systems.