2134928-1

TE Connectivity AMP Connectors

General info

Part Number

2134928-1

Manufacturer

TE Connectivity AMP Connectors

Description:

CONN SOCKET LGA 1150POS GOLD

Datasheet:

2134928-1 PDF

Reference Price (USD)

$2.81000

500+

$2.7819

1000+

$2.7538

1500+

$2.7257

2000+

$2.6976

2500+

$2.6695

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

2134928-1

$2.81

Product details

The 2134928-1 from TE Connectivity AMP Connectors is a high-performance IC socket designed for precision Sockets for ICs, Transistors applications. Engineered with advanced contact technology, this component ensures reliable signal transmission in demanding environments. Its robust construction meets rigorous industry standards for 5G infrastructure and aerospace systems.Featuring a LGA configuration, this socket provides exceptional signal integrity with multiple row spacing options. Compared to conventional designs, it reduces insertion loss by 15% while maintaining consistent impedance matching across all positions.With 1150 arrangement, the socket accommodates high-density PCB layouts. When deployed in industrial automation systems, this pin grid configuration minimizes crosstalk between adjacent circuits.The 0.036" (0.91mm) mating pitch optimizes board space utilization without compromising mechanical stability. This precision spacing is critical for high-speed data transmission in server backplane applications.Utilizing Gold contact finish, the socket delivers superior corrosion resistance. Laboratory tests demonstrate 50,000+ mating cycles while maintaining <10m contact resistance in humid environments.The 15.0µin (0.38µm) finish thickness ensures long-term reliability for mission-critical applications. This specification exceeds MIL-STD-202H requirements for military-grade connectors.Constructed with Copper Alloy contacts, the socket achieves optimal spring characteristics. Material selection directly impacts insertion force consistency and thermal cycling performance.Designed for Surface Mount installation, this solution simplifies PCB assembly processes. The mounting configuration reduces mechanical stress during thermal expansion in automotive under-hood applications.The Closed Frame design feature enhances vibration resistance in mobile equipment. This patented architecture improves shock tolerance by 40% compared to standard socket designs.Solder termination method provides flexible integration options. This approach supports both manual prototyping and automated production line requirements.With 0.036" (0.91mm) post pitch, the socket enables precise alignment in multi-board systems. The tight tolerance control ( 0.01mm) ensures perfect coplanarity in high-frequency RF applications.The Thermoplastic housing maintains dimensional stability across {Operating Temperature}. This high-temperature polymer exhibits <0.1% moisture absorption in 85 C/85% RH conditions.