2132574-3
TE Connectivity AMP Connectors
2132574-3
TE Connectivity AMP Connectors
IMP100,O,H,V3P6C,UG,LEW46
Reference Price (USD)
1+
$6.75225
500+
$6.6847275
1000+
$6.617205
1500+
$6.5496825
2000+
$6.48216
2500+
$6.4146375
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
2132574-3
$6.75
Product details
The 2132574-3 by TE Connectivity AMP Connectors revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Specifically developed for Backplane, Orthogonal implementations, this series excels in co-packaged optics interconnect applications.Featuring Header, Male Pins configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.The Impact design incorporates advanced crosstalk suppression techniques, critical for maintaining eye diagram integrity in high-speed serial links.With 54 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.The 0.075" (1.90mm) micro-pitch design enables breakthrough density while maintaining impedance control for 112G SerDes channels.9 row configuration supports orthogonal direct-attach copper architectures in disaggregated server designs.The 6 column architecture enables efficient routing of wide parallel buses in memory-centric computing systems.Through Hole installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Press-Fit process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.The 36 Signal, 18 Ground arrangement implements optimized return current paths essential for reducing simultaneous switching noise in AI accelerator cards.Gold plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.30.0µin (0.76µm) coating thickness ensures compliance with IEC 60512-99-001 fretting corrosion requirements.The Black housing material incorporates laser-markable surfaces for traceability in automated manufacturing environments.
Product Attributes
- Product Status: Active
- Connector Usage: Backplane, Orthogonal
- Connector Type: Header, Male Pins
- Connector Style: Impact
- Number of Positions: 54
- Number of Positions Loaded: All
- Pitch: 0.075" (1.90mm)
- Number of Rows: 9
- Number of Columns: 6
- Mounting Type: Through Hole
- Termination: Press-Fit
- Contact Layout, Typical: 36 Signal, 18 Ground
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Black
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